Infrared inspection system TR7950Q SII

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Introduction
The TR7950Q SII is a modular wafer inspection and micro-measurement metrology platform designed for advanced semiconductor production. It integrates AI-driven algorithms and optional sensing modules (SWIR, 3D DFF, TSV/Thin-Film) to detect subsurface defects and perform high-precision measurements for yield optimization.

Features

• High-resolution wafer inspection
• Precise micro measurements with metrology capabilities
• Ultra-high-speed TSV & thin-film metrology
• Inner defect detection with optional SWIR (Short-Wave Infrared)
• 0.5 µm / 1 µm resolution available via optional DFF (Depth From Focus)
• Cleanroom capable: ISO Class 5
• TSV measurement: sensing TSV depth, trench depth
• Thin-film measurement: oxide, nitride, PR, PI thickness

Optical System
Imaging Method: Stop-and-Go Imaging
Camera: 25 Mpix
Optical Resolution: 2.5 µm
Lighting: Multi-phase True Color LED; Coaxial lighting
3D Technology: Quad Digital Fringe Projectors
Max. 3D Height: 600 μm

Wafer and Frame Handling
Wafer sizes: 6", 8", 12"
Frame sizes: 8", 12"

Clean Room
Clean Room Class: ISO Class 5 (ISO 14644-1)

Motion Table & Control
X Axis: Linear motor with motion controller + air bearing or linear guide
Y Axis: Linear motor with motion controller + air bearing or linear guide
Z Axis: Ball screw + linear guide + AC servo motor with motion controller OR linear guide + linear motor with motion controller
X-Y Axis Resolution: 0.1 µm

Inspection and Metrology Functions
Patterned wafers: residues, cracks, scratches, particles, pad abnormalities, discoloration, contamination, peeling, probe mark defects, CD measurement
Bump wafers: 2D bump size, 3D bump height, bump defects, foreign material, CD measurement
Wafer frames: chipping, cracks, scratches, particles, contamination, CD measurement, saw 3D metrology
Wafer topology: wafer thickness, top-side warpage
TSV: sensing TSV depth, trench depth
Thin film: oxide, nitride, PR, PI film thickness

Optional Features
Optional sensing technologies: 3D DFF Module (0.55 or 1 µm), SWIR Module (1, 2 or 4 µm), CSS Module, TSV/Thin-Film Module
TSV / Thin-Film Module: spot size 50 µm / 25 µm; TSV aspect ratio up to 30:1; via diameter 3–20 µm; film thickness range 100 nm – 30 µm

Dimensions
WxDxH: 1235 x 2590 x 2050 mm (varies with EFEM)
Weight: 2300 kg (without EFEM)

Notes
* DFF and SWIR are optional and can be installed; compatible with TSV/Thin-Film and CSS modules.

Technical specifications

• Model: TR7950Q SII
• Brand: Test Research, Inc. (TRI)
• Imaging Method: Stop-and-Go Imaging
• Camera: 25 Mpix
• Optical Resolution: 2.5 µm
• 3D Technology: Quad Digital Fringe Projectors
• Max. 3D Height: 600 μm
• Lighting: Multi-phase True Color LED; Coaxial lighting
• Wafer sizes supported: 6", 8", 12"
• Frame sizes supported: 8", 12"
• Cleanroom: ISO Class 5 (ISO 14644-1)
• X-Y Axis Resolution: 0.1 µm
• Optional modules: SWIR (1/2/4 µm), 3D DFF (0.55 or 1 µm), CSS, TSV/Thin-Film Module
• TSV module: spot sizes 50 µm / 25 µm; TSV aspect ratio up to 30:1; via diameter 3–20 µm
• Film thickness measurement range: 100 nm – 30 µm
• Dimensions (WxDxH): 1235 x 2590 x 2050 mm (varies with EFEM)
• Weight (without EFEM): 2300 kg