Optical inspection system TR7720S

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Introduction
The TR7720S is an AI-capable small-form Automated Optical Inspection (AOI) system for the semiconductor and packaging industry, designed to inspect wire bonding, die bonding, SMD components and solder joints. With optional metrology-grade measurement modules and a rigid mechanical frame, the TR7720S provides high-precision inspection. The 5.5 µm high-resolution optical configuration supports detection of wire diameters down to 50 µm (2 mil).

Key features

• Package defect detection for wire bonding and die bonding
• 5.5 µm high-resolution small form factor AOI
• AI-powered inspection algorithms for wire detection (optional)
• Metrology-grade measurement modules (optional) for traceable results
• Inspection of Au, Al, Ag and Cu wires down to 50 µm
• Bond inspection types: ball bond, wedge bond, ribbon bond
• Industry 4.0 ready — real-time SPC trends
• Optional modules indicated where noted

Optical system
Imaging method: Stop-and-Go imaging
Top camera: 12 Mpix
Imaging resolution: 5.5 µm
Lighting: Multi-phase true-color LED and coaxial lighting

Imaging performance
Max. imaging speed: 10.3 cm²/sec

Motion table & control
X-Y-Z axis control: Ballscrew + AC servo with motion controller
X-Y-Z axis resolution: 1 µm

Board handling
Max. PCB size: 310 x 250 mm
PCB thickness: 0.1–5 mm
Max. PCB weight: 1 kg
Top clearance: 25 mm
Bottom clearance: 40 mm
Edge clearance: 3 mm
Conveyor inline height: 880–920 mm (SMEMA compatible)

Inspection functions

• Die bonding detection: missing, orientation, shift, rotation, chipping, crack, scratch, foreign material, epoxy on die, epoxy coverage
• Molding / underfill materials (EMC, CUF, NCP, NCF, MUF): area coverage, shapes/dimensions, surface defects, voids, damage, cracks, scratches, delamination, contamination, particles
• Bonding area / pad checks: copper protrusion, crack, chipping, exposed copper/exposed nickel, target material issues, scratches or brush marks, oxidation, foreign material

Dimensions
WxDxH: 750 x 1460 x 1700 mm (signal tower not included; signal tower height 272.5 mm)
Weight: 710 kg

Optional modules / notes
AI-powered wire detection and metrology functions are optional modules where noted.

Technical specifications

• Model: TR7720S
• Imaging method: Stop-and-Go imaging
• Top camera: 12 Mpix
• Imaging resolution: 5.5 µm
• Max. imaging speed: 10.3 cm²/sec
• Lighting: Multi-phase true-color LED, coaxial lighting
• X-Y-Z axis control: Ballscrew + AC Servo with motion controller
• X-Y-Z axis resolution: 1 µm
• Max. PCB size: 310 x 250 mm
• PCB thickness: 0.1 - 5 mm
• Max. PCB weight: 1 kg
• Top clearance: 25 mm
• Bottom clearance: 40 mm
• Edge clearance: 3 mm
• Conveyor inline height: 880 – 920 mm (SMEMA compatible)
• Detectable wire diameters: down to 50 μm (2 mil)
• Bond inspection types: ball bond, wedge bond, ribbon bond
• Dimensions (WxDxH): 750 x 1460 x 1700 mm
• Weight: 710 kg
• Optional modules: AI-powered wire detection, metrology-grade measurement modules