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CMOS inspection system TR7900Q SII
video visionLEDcamera

CMOS inspection system - TR7900Q SII - TRI Test Research Europe GmbH - video vision / LED / camera
CMOS inspection system - TR7900Q SII - TRI Test Research Europe GmbH - video vision / LED / camera
CMOS inspection system - TR7900Q SII - TRI Test Research Europe GmbH - video vision / LED / camera - image - 2
CMOS inspection system - TR7900Q SII - TRI Test Research Europe GmbH - video vision / LED / camera - image - 3
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Characteristics

Technology
camera, 3D, AI, LED, video vision, CMOS
Operational mode
automatic
Type
quality control, for defect detection, surface defect, measurement, BGA, soldering
Applications
for the packaging industry, for the electronics industry
Configuration
in-line
Other characteristics
high-resolution, computer-controlled, LED, non-contact

Description

Introduction
The TR7900Q SII is built on a 2.5 μm high-resolution platform with 25 MPix imaging technology for the semiconductor and advanced packaging industry. AI-powered algorithms and metrology capabilities enhance the Smart 3D AOI solution's effectiveness. The 3D SEMI AOI fully integrates with loader/unloader modules to simplify handling of strips and magazines. The Stop-and-Go 3D AOI inspects die bonding, wire/ball/ribbon/wedge bonding, SiP, underfill, SMD, bumps and solder joints. The Smart Factory AOI inspects wire diameters down to 15 μm (0.6 mil).

Features
  • Advanced package defect detection for wire bonding and die bonding
  • 2.5 μm high-resolution 3D AOI with metrology-grade measurement capabilities
  • Built-in loader and unloader for magazine handling
  • AI-powered wire detection (optional)
  • Inspection of Au, Al, Ag and Cu wires down to 15 μm
  • Bond inspection: ball bond, wedge bond, ribbon bond
  • Shortwave Infrared (SWIR) lighting for inner crack and chipping detection (optional)
  • Clean room compatibility: Class 1000 (ISO Class 6, ISO 14644-1)


Optical System (key items)
Imaging method: Stop-and-Go Imaging
Top camera: 25 Mpix
Imaging resolution: 2.5 μm
Lighting: Multi-phase true color LED
3D technology: Quad digital fringe projectors
Max. 3D height range: 15 mm

Motion Table & Control (key items)
X-axis control: Ball screw + AC servo motor or linear motor
Y-axis control: Dual ball screw + AC servo motor or dual linear motor (optional)
Z-axis control: Ball screw + AC servo motor (reducer optional)
X-Y axis resolution: 0.1 μm

Board / Magazine Handling (key items)
Max. stack magazine qty.: 3 magazines (based on magazine width 125 mm)
Magazine width: 50 - 175 mm
Magazine length: 120 - 320 mm
Magazine height: 80 - 150 mm
Strip width*: 35 - 150 mm
Strip length: 100 - 285 mm
Strip thickness: 0.1 - 1.5 mm
*When strip width is between 35–54 mm, special design required
Max. strip weight: 0.5 kg
Strip carrier / fixing: Belt conveyor
Top clearance: 7 mm
Bottom clearance: 10 mm
Edge clearance: 3 mm

Inspection Functions (examples of detectable defects and measurements)
Die bonding: missing, orientation, rotation, shift, tilted, chipping, crack, scratch, foreign material; bond line thickness; epoxy on die; epoxy coverage; epoxy height
Wire bonding: broken, short, sweep/sink, missing, sway, collapse, loop height, sagged wire, cross wire gap; wire tracing; ball bond diameter; ball placement; stitch width; stitch coverage over ball; ball-off pad; clubbed ball; ball thickness; lifted ball; low landing; bond on contamination; foreign material
Bonding area / pad: copper protrusion; crack; chipping; exposed copper; exposed nickel; target material; scratches or brush marks; oxidation; foreign material

Dimensions & Weight
WxDxH (without auto load/unload module): 990 x 1495 x 1700 mm
WxDxH (with auto load/unload module): 2065 x 1490 x 1700 mm
Note: signal tower not included; signal tower height 515 mm
Weight: 823 kg (without auto load/unload module); 989.5 kg (with auto load/unload module)

Notes
Optional modules: AI-powered wire detection, SWIR lighting and other optional modules may be available. The system integrates loader/unloader modules to facilitate handling of strips and magazines.

Technical specifications
  • Model: TR7900Q SII
  • Imaging method: Stop-and-Go Imaging
  • Top camera resolution: 25 Mpix
  • Imaging resolution: 2.5 μm
  • Lighting: Multi-phase true color LED (SWIR optional)
  • 3D technology: Quad digital fringe projectors
  • Max. 3D height range: 15 mm
  • X-Y axis resolution: 0.1 μm
  • X-axis control: Ball screw + AC servo motor or linear motor
  • Y-axis control: Dual ball screw + AC servo motor or dual linear motor (optional)
  • Z-axis control: Ball screw + AC servo motor (reducer optional)
  • Max. stack magazines: 3 (based on 125 mm magazine width)
  • Magazine width: 50 - 175 mm
  • Magazine length: 120 - 320 mm
  • Magazine height: 80 - 150 mm
  • Strip width: 35 - 150 mm (special design for 35–54 mm)
  • Strip length: 100 - 285 mm
  • Strip thickness: 0.1 - 1.5 mm
  • Max. strip weight: 0.5 kg
  • Carrier / fixing: Belt conveyor
  • Top clearance: 7 mm; Bottom clearance: 10 mm; Edge clearance: 3 mm
  • WxDxH (no loader): 990 x 1495 x 1700 mm
  • WxDxH (with loader): 2065 x 1490 x 1700 mm
  • Weight: 823 kg (no loader); 989.5 kg (with loader)

Exhibitions

Meet this supplier at the following exhibition(s):

ELECTRONICA 2026
ELECTRONICA 2026

10-13 Nov 2026 Munich (Germany) Hall A4 - Stand 638

  • More information
    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.