Optical inspection system TR7700QE-S

camera3Dautomatic

Introduction
The TR7700QE-S is built on a high-precision platform using 12 MP imaging with 5.5 µm resolution for the Semiconductor and Packaging industry. The Stop-and-Go 3D AOI inspects wire bonds, die bonds, SMD, bumps and solder joints. Metrology-capable optics and adaptable inspection algorithms improve measurement accuracy and defect detection.

Features

• Designed for semiconductor and packaging technology inspection
• Stop-and-Go 3D AOI with ultra-high imaging resolution
• Inspection of wire bonding, die bonding and SMD defects
• Fast setup: ready to inspect in minutes with TRI Smart Programming

Optical System
Imaging method: Stop-and-Go Imaging
Top camera: 12 Mpix (12 MP)
Imaging resolution: 5.5 µm
Lighting: Multi-phase True Color LED

Imaging Performance
Max. imaging speed: 12 Mpix 3D @ 5.5 µm = 4.1 cm²/sec; 12 Mpix 2D @ 5.5 µm = 10.3 cm²/sec
Note: Actual speed depends on component distribution and inspection recipe

Motion Table & Control
X axis control: Linear motor with motion controller (option: ballscrew + AC servo)
Y axis control: Dual-driven ballscrew + AC servo with motion controller
Z axis control: Ballscrew + AC servo with motion controller
X-Y axis resolution: 1 µm

Board Handling
Max. PCB size: 330 x 330 mm (depends on component distribution)
PCB thickness: 0.6 - 5 mm
Max. PCB weight: 3 kg
Top clearance: 25 mm
Bottom clearance: 40 mm (optional 100 mm)
Edge clearance: 3 mm (optional 4 mm / 5 mm)
Conveyor: Inline height 880 - 920 mm (SMEMA compatible)

Inspection Functions

• Component defects: Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong marking (OCV), Defective / Upside down, Extra component, Foreign material, Lifted component
• Solder joint defects: Solder fillet height, Solder volume %, Excess solder, Insufficient solder, Bridging, Through-hole pins, Lifted lead, Golden finger scratch/contamination

Dimensions
WxDxH: 1100 x 1730 x 1750 mm (signal tower not included; signal tower height 520 mm)
Weight: 920 kg

Video
Official product video available showing TR7700QE-S demonstration and overview.

Technical specifications

• Model: TR7700QE-S
• Imaging method: Stop-and-Go Imaging
• Top camera: 12 Mpix (12 MP)
• Imaging resolution: 5.5 µm
• Lighting: Multi-phase True Color LED
• Max. imaging speed: 12 Mpix 3D @ 5.5 µm = 4.1 cm²/sec; 12 Mpix 2D @ 5.5 µm = 10.3 cm²/sec
• X-Y axis resolution: 1 µm
• Motion control: Linear motor with motion controller (X); dual-driven ballscrew + AC servo (Y); ballscrew + AC servo (Z)
• Max. PCB size: 330 x 330 mm
• PCB thickness range: 0.6 - 5 mm
• Max. PCB weight: 3 kg
• Top clearance: 25 mm; Bottom clearance: 40 mm (optional 100 mm)
• Edge clearance: 3 mm (optional 4 mm / 5 mm)
• Conveyor inline height: 880 - 920 mm (SMEMA compatible)
• WxDxH (machine): 1100 x 1730 x 1750 mm
• Machine weight: 920 kg