Optical inspection system TR7900Q SII-R

infraredvideo visioncamera

Introduction
The TR7900Q SII-R is a 3D Automated Inspection and Rejection Station designed for the Semiconductor and Advanced Packaging industry. It integrates a high-resolution 2.5 μm imaging platform with a built-in loader/unloader to simplify handling of strips and magazines and supports inspection of die bond, wire bond, bumps and solder joints down to 15 μm wire diameter.

Key Features

• Advanced-package defect detection for die bonding, ball/wedge/ribbon wire bonding
• Inking module for reject identification (ink printer or ink pen optional)
• 2.5 μm high-resolution 3D AOI with metrology-grade measurement capability
• Built-in loader and unloader for magazine handling (up to 3 magazines)
• Optional AI-powered wire detection algorithms
• Inspection of Au, Al, Ag and Cu wires down to 15 μm
• Shortwave infrared (SWIR) lighting option for inner crack and chipping detection
• Clean room compatibility: Class 100 (ISO Class 5 per ISO 14644-1)

Optical System
Imaging method: Stop-and-Go Imaging
Top camera: 25 Mpix
Imaging resolution: 2.5 μm
Lighting: Multi-phase True Color LED (SWIR optional)
3D technology: Quad digital fringe projectors
Max. 3D height range: 600 μm

Defect Marking Method
Marking method: Ink printer (optional ink pen)

Motion Table & Control
X axis control: Linear motor
Y axis control: Dual linear motor
X-Y axis resolution: 0.1 μm

Board Handling
Max. stack magazine qty.: 3 (based on 125 mm magazine width)
Magazine dimensions (W x L x H): 50 - 175 mm x 120 - 320 mm x 80 - 160 mm
Strip dimensions (W x L x T): 35 - 180 mm x 100 - 300 mm x 0.1 - 1.5 mm
Max. strip weight: 0.4 kg
Strip carrier / fixing: Gripper conveyor
Top clearance: 15 mm
Bottom clearance: 6 mm
Edge clearance: 3 mm

Inspection Functions

Die Bonding

• Missing
• Orientation
• Rotation
• Shift
• Tilted
• Chipping
• Crack
• Scratch
• Foreign material
• Bond line thickness
• Epoxy on die
• Epoxy coverage
• Epoxy height

Wire Bonding

• Broken
• Short
• Sweep / Sink
• Missing
• Sway
• Collapse
• Loop height
• Sagged wire
• Cross wire gap
• Wire tracing
• Ball bond diameter
• Ball placement
• Stitch width
• Stitch coverage over ball
• Ball-off pad
• Ball touch pad distance
• Clubbed ball
• Ball thickness
• Lifted ball
• Low landing
• Bond on contamination
• Foreign material

Bonding Area / Pad

• Copper protrusion
• Crack
• Chipping
• Exposed copper
• Exposed nickel
• Target material
• Scratches or brush marks
• Oxidation
• Foreign material

Dimensions
WxDxH: 2370 x 1455 x 1700 mm (signal tower not included; signal tower height 515 mm)
Weight: 1120 kg (1280 kg with Auto Load/Unload Module)

Technical Specifications

• Model: TR7900Q SII-R
• Brand: Test Research, Inc. (TRI)
• Imaging method: Stop-and-Go Imaging
• Top camera: 25 Mpix
• Imaging resolution: 2.5 μm
• 3D technology: Quad digital fringe projectors
• Max. 3D height range / measurement: 600 μm
• Max. wire inspection diameter: down to 15 μm
• Lighting: Multi-phase True Color LED (SWIR optional)
• Defect marking: Ink printer (Ink pen optional)
• X axis control: Linear motor
• Y axis control: Dual linear motor
• X-Y axis resolution: 0.1 μm
• Max. stack magazine qty.: 3 (based on 125 mm magazine width)
• Magazine dimensions (W x L x H): 50 - 175 mm x 120 - 320 mm x 80 - 160 mm
• Strip dimensions (W x L x T): 35 - 180 mm x 100 - 300 mm x 0.1 - 1.5 mm
• Max. strip weight: 0.4 kg
• Top clearance: 15 mm; Bottom clearance: 6 mm; Edge clearance: 3 mm
• Overall dimensions (WxDxH): 2370 x 1455 x 1700 mm
• Weight: 1120 kg (1280 kg with Auto Load/Unload Module)
• Clean room: Class 100 - ISO Class 5 (ISO 14644-1)