Optical inspection system TR7007 SII Ultra

multi-spectralcamera3D

Introduction
The TR7007 SII Ultra is a high-resolution 6 µm / 10 µm 3D SEMI SPI platform designed for SEMI back-end solder inspection and metrology. It delivers solder measurements (height, area, volume, offset), supports wide-spectrum lighting for improved contrast and defect detection, and integrates Industry 4.0 standards including closed-loop feedback/feed-forward, IPC-CFX and IPC Hermes 9852.

Applications

• Bumps
• Flux
• Glue
• Solder Paste
• Surface inspection

Features

• SEMI back-end inspection up to 74 cm2/sec (10 µm)
• Precise solder metrology with TRI SPI measurement algorithms
• Wide-spectrum 2D (RGB+W) and coaxial lighting for enhanced contrast
• Rapid programming and setup using TRI smart programming
• Closed-loop ready: feedback and feed-forward integration
• Smart factory features with real-time SPC trends

Optical System
Imaging method: Dynamic Scan
Top camera: 4 Mpix
Imaging resolution: 6 µm / 10 µm
Lighting: Wide Spectrum 2D Lights (RGB+W), Coaxial Lighting

Imaging Performance
Max. imaging speed: 6 µm: 25 cm2/sec; 10 µm: 74 cm2/sec

Motion Table & Control
X-axis control: Linear motor + Linear scale + EtherCAT servo
Y-Z axis drive: AC motor with ball screw + EtherCAT servo
X-Y axis resolution: 0.5 µm
Z axis resolution: 1 µm

Board Handling
Max. PCB size: Standard: 510 x 460 mm; DL variants: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB thickness: 0.5–6 mm
Max. PCB weight: 3 kg
Top clearance: 25 mm
Bottom clearance: 40 mm
Edge clearance: 3 mm
Conveyor inline height: 880–920 mm (SMEMA compatible)

Inspection Functions
Typical applications: Bare board, bumps, flux, mini-LED solder, solder paste
Defects detected: Insufficient paste, excessive paste, shape deformity, missing paste, bridging
Measurements: Height, area, volume, offset

Dimensions
WxDxH (standard): 1100 x 1560 x 1710 mm; DL: 1100 x 1860 x 1710 mm
Note: signal tower not included (signal tower height 395 mm)
Weight: Standard: 740 kg; DL: 925 kg

Technical specifications

• Product name: TR7007 SII Ultra
• Imaging method: Dynamic Scan
• Top camera: 4 Mpix
• Imaging resolution: 6 µm / 10 µm
• Lighting: Wide Spectrum 2D Lights (RGB+W), Coaxial Lighting
• Max. imaging speed: 6 µm: 25 cm2/sec; 10 µm: 74 cm2/sec
• X-axis control: Linear motor + Linear scale + EtherCAT servo
• Y-Z axis drive: AC motor with ball screw + EtherCAT servo
• X-Y axis resolution: 0.5 µm
• Z axis resolution: 1 µm
• Max. PCB size: 510 x 460 mm (standard); DL variants supported
• PCB thickness range: 0.5–6 mm
• Max. PCB weight: 3 kg
• Top clearance: 25 mm; Bottom clearance: 40 mm; Edge clearance: 3 mm
• Conveyor inline height: 880–920 mm (SMEMA compatible)
• Dimensions (WxDxH): 1100 x 1560 x 1710 mm (standard)
• Weight: 740 kg (standard)
• Industry 4.0 ready: Closed-loop feedback / feed-forward, IPC-CFX, IPC Hermes 9852
• Typical applications: Bumps, flux, glue, solder paste, surface inspection