X-ray inspection machine XT V 130

NDTcomputed tomographyCT

Overview
Nikon XT V Series X‑ray CT inspection systems provide high‑resolution non‑destructive inspection for electronic components (PCBs, BGAs, chips) and semiconductor devices. Designed for R&D, QA/QC and failure analysis, the series combines Xi microfocus X‑ray sources, an open‑tube design with replaceable filaments and integrated HV generator to reduce maintenance and operating costs.

Product Highlights

• Automatic inspection: Inspect‑X interface and PCB Analysis Suite enable rapid setup of automated inspection programs with measurements and pass/fail reporting for BGA, bond wires, PTH and complex packages.
• Continuous protection: Automatic collision avoidance and Low Dose Collimator minimise X‑ray exposure during batch inspection; optional ESD Safety Upgrade protects sensitive semiconductor and electronic components.
• User‑friendly manipulator: Vertical configuration (X‑ray source below sample, tilting imager above), precise joystick control and intelligent motion keep the region of interest in view during 360° rotation.

Premium Data Quality

• Xi microfocus X‑ray sources deliver sharp, stable images; Diamond Window improves contrast across the operating range.
• Open tube with replaceable filaments reduces long‑term running costs.
• High.Contrast Filter 2.0 enhances visibility of high‑ and low‑contrast details within a single image to accelerate defect identification.

Imaging & Inspection Features

• Inspect‑X software provides operator‑focused workflows, advanced imaging and analysis tools optimised for electronics inspection.
• Automatic collision avoidance and intelligent motion control allow safe, precise scanning at extreme oblique angles.
• Optional ESD Safety Upgrade complies with industry ESD standards for handling sensitive devices during inspection.

Specifications (tabular summary)
Model | XT V 160 | XT V 130C
Maximum kV | 160 kV | 130 kV
X‑ray source | Open tube with replaceable filaments (both models)
High voltage generator | Integrated generator — no HV cable maintenance required (both models)
Feature recognition | Submicron (XT V 160) | Micron‑level (XT V 130C)
Viewing angle range | Up to 82° in any direction (XT V 160) | Up to 79° in any direction (XT V 130C)
Sample tray | Carbon fibre tray, 580 mm diameter (both models)
Cabinet dimensions (W x D x H) | 1,260 x 1,789 x 1,904 mm (both models)
System weight | ≈2,100 kg (both models)
ESD safety | Optional ESD Safety Upgrade compliant with industry standards (both models)
Primary applications | Automated and real‑time electronics and semiconductor inspection for R&D, QA/QC and failure analysis (XT V 160) | Real‑time electronics inspection (XT V 130C)

Technical characteristics / specifications

• Models: XT V 160 and XT V 130C.
• Maximum accelerating voltage: 160 kV (XT V 160) / 130 kV (XT V 130C).
• X‑ray source: Open tube with replaceable filaments; Xi microfocus X‑ray sources for sharp, stable images.
• Generator: Integrated high‑voltage generator (no external HV cable maintenance required).
• Resolution / feature recognition: Submicron (XT V 160) and micron‑level (XT V 130C).
• Viewing angle: Up to 82° (XT V 160) and up to 79° (XT V 130C) in any direction for oblique imaging.
• Sample accommodation: 580 mm carbon fibre sample tray; optional heavy‑duty tray for larger batches.
• Dimensions (W x D x H): 1,260 x 1,789 x 1,904 mm.
• System weight: Approximately 2,100 kg.
• Radiation protection: Low Dose Collimator to minimise exposure during inspection.
• ESD protection: Optional ESD Safety Upgrade for compliance with industry ESD standards.
• Software & automation: Inspect‑X with PCB Analysis Suite for automated measurement, BGA/bond‑wire/PTH/PoP analysis, automated pass/fail inspection and reporting.
• Image enhancement: High.Contrast Filter 2.0 for combined high‑ and low‑contrast detail visibility.