X-ray inspection machine XT H series

computed tomographyCT3D

Overview
Nikon's XT H series are helical microfocus X-ray CT scanners for high-resolution inspection of components ranging from miniature plastic connectors to aluminium castings. Systems are intended for R&D, failure analysis and production quality control with configurations for inspection and metrology.

Adaptable Solutions
These CT systems combine laboratory adaptability with production-ready functions to reduce cycle time and improve uptime, including configurable sources/targets, X.Tend Helical CT acquisition and motorised source‑to‑detector distance adjustment.

Product Highlights

• Flexibility when you need it: Choice of X-ray source, targets, CT scanning strategies and options such as motorised FDD (source‑to‑detector distance) adjustment to cover a wide range of inspection tasks.
• X.Tend Helical CT: Scan tall objects in a single continuous acquisition to eliminate cone-beam and stitching artefacts and enable higher magnification for increased resolution.
• 225 kV Rotating.Target 2.0: Enables continuous operation up to 450 W (depending on configuration) for higher resolution at given power or faster data collection at a given resolution.

Core Features

• X.Tend Helical CT for artifact-free high-resolution scans: Continuous helical acquisition for tall parts; resolution increases by positioning the sample closer to the source.
• Offset.CT for wider and higher-resolution scans: Scan components wider than the detector and move samples closer to the source for higher effective resolution.
• Traceable measurement accuracy: Metrology-grade option (MCT225) designed for high-accuracy measurement with MPE verification per VDI/VDE 2630 and Local.Calibration support.
• Industry-leading image quality: Large-area flat-panel detectors with small pixel sizes and fast exposures combined with microfocus X-ray sources for high-resolution datasets.
• Dual.Material CT for production: Reconstruction technique for automatic inspection of dual-material parts with reduced artefacts from high-density materials.
• Auto.Filament Control: Intelligent filament management to extend filament lifetime and increase system availability.
• Half.Turn CT: Optimised reconstruction enabling artifact-free data from roughly half the usual projections to significantly reduce acquisition time.

Comparison (summary from product page)
Models included: XT H225 | XT H225 ST 2x | MCT225
Part size: XT H225 (small–medium) · XT H225 ST 2x (wider range) · MCT225 (small–medium) · Part density and accuracy vary by model and configuration.

Applications

• R&D and failure analysis
• Production quality control and shop-floor series inspection
• Inspection of small to large components including plastics, castings and multi‑density/dual‑material parts

Technical specifications

• X-ray source options including 225 kV Rotating.Target 2.0
• Continuous operation capability up to 450 W (dependent on source/target configuration)
• X.Tend Helical CT acquisition mode for tall objects and artifact-free continuous scanning
• Half.Turn CT acquisition mode for reduced acquisition time with artifact-free reconstructions
• Auto.Filament Control to extend filament lifetime and improve uptime
• Offset.CT capability to scan components larger than the detector and increase resolution by closer source placement
• Dual.Material CT reconstruction for improved images of dual/high-density materials
• Metrology-grade option (MCT225) with MPE verification according to VDI/VDE 2630 and Local.Calibration support
• Large-area flat-panel detectors with small pixel sizes and fast exposures
• Microfocus X-ray sources with small focal spot size for high-resolution datasets