OverviewNikon large‑envelope X‑ray and CT systems inspect internal and external features of parts across wide size and density ranges. Systems pair metrology‑grade granite‑base manipulators with large scan envelopes, configurable multi‑source options, dual‑detector support and multiple CT acquisition modes to meet production, inspection bureau and R&D requirements.
Key features- Highly configurable platform with multiple X‑ray sources, detector choices and granite‑base lengths
- Multi‑source capability (some configurations support up to three sources) to optimise penetration, resolution and speed
- Dual‑detector options for concurrent high‑throughput DR and CT workflows
- Metrology‑grade granite manipulators for mechanical and thermal stability
- Large scanning envelope with panel shift and synchronous Y‑axis movement for wider/taller objects
- Advanced acquisition modes including Offset.CT, Panel Shift and Helical CT (X.Tend)
- Scatter correction and AI reconstruction options to improve image quality on dense parts
- Automation interfaces (Nikon Automation OPC UA) for robotic loading and production integration
Product highlights- Modular configurations: choice of microfocus and high‑power sources, multiple flat‑panel detectors and enclosure options (single‑cabinet, panelised room, manipulator‑only)
- Multi‑source workflows to balance penetration and throughput for mixed applications
- Dual‑detector flexibility: small‑pixel flat panels plus CLDA and fast exposures for CT/DR
- Granite‑based metrology manipulator: rigid towers, precision motors and encoders for repeatable positioning
- Large scan capability: panel shift + synchronous motion enable swept diameters up to ~1000 mm and system heights >1500 mm (model dependent)
- Production ready: integrates with robotic loaders and OPC UA for Quality 4.0 environments
Models and standard scan volumesVOXLS 40 C 450 | Standard scan volume: 800 mm (Ø) × 1415 mm (H) | Max payload: 275 kg | Synchronous‑style manipulator
M2 | Standard scan volume: 630 mm (Ø) × 988 mm (H) | Max payload: 180 kg | Bridge‑style manipulator
C2 | Standard scan volume: 1090 mm (Ø) × 1285 mm (H) | Max payload: 275 kg | Synchronous‑style manipulator
C3 | Standard scan volume: 1090 mm (Ø) × 2460 mm (H) | Max payload: 400 kg | Synchronous‑style manipulator
Advanced acquisition & image options- Offset.CT and Panel Shift for single‑pass scans of objects wider than a detector
- Helical CT (X.Tend) for tall parts to reduce cone‑beam artefacts and stitching
- High‑power rotating‑target and microfocus sources (e.g. 225 kV Rotating.Target 2.0, 450 kV microfocus rotating target) for improved throughput and SNR
- CLDA and small‑pixel flat panels for high‑resolution, high‑throughput CT and DR
- Scatter Correction CT and AI Reconstruction to enhance measurement confidence on dense materials
Industrial applications- Automotive components and assemblies
- Energy and turbine component inspection
- Aerospace and defence parts (blades, castings, assemblies)
- Metal additive manufacturing and casting QA
- Academia and R&D materials characterisation
Characteristics / technical specifications- Configurable X‑ray sources: microfocus and high‑power options; rotating‑target designs available
- Detector options: multiple industry‑leading flat‑panel detectors; dual‑detector support on many configurations
- Manipulator constructions: metrology‑grade granite base; synchronous‑style or bridge‑style manipulators
- Scan envelope capability: panel shift and Offset.CT to extend swept diameter up to ~1000 mm and heights >1500 mm (model dependent)
- Payload capacities: examples — 180 kg (M2), 275 kg (VOXLS 40 C 450, C2), 400 kg (C3)
- Acquisition modes: Offset.CT, Panel Shift, Helical CT (X.Tend), limited‑angle and advanced CT modes
- Image enhancement: Scatter Correction CT, AI Reconstruction and CLDA for dense parts
- Automation & integration: Nikon Automation OPC UA for robotic loaders and shop‑floor integration
- Enclosure options: single‑piece cabinet, panelised room (C2/C3) or manipulator‑only for existing shielded enclosures
- Typical applications: metrology, defect detection, assembly inspection, additive manufacturing QA