X-ray inspection machine XT V 160

NDTcomputed tomographyCT

Product Overview
Nikon's XT V Series comprises X-ray and CT inspection systems for non-destructive testing of electronic components such as PCBs, BGAs and chips. The series pairs Xi microfocus X-ray sources with Inspect-X software and offers options including Low Dose Collimator and ESD Safety Upgrade to support batch inspection and protection of sensitive devices.

Key Features

• High-resolution inspection for PCBs, BGAs, bond wires, PTH and complex packages.
• Automated inspection workflows with Inspect-X and PCB Analysis Suite for fast pass/fail programs and reporting.
• Vertical system configuration with precise manipulator and joystick control enabling 360° rotation and intelligent motion to keep the region of interest in view.
• Automatic collision avoidance and operator-focused interfaces for safer operation.
• Low Dose Collimator option to minimise X-ray exposure for radiation‑sensitive semiconductor devices and enable larger batch inspections.
• Optional ESD Safety Upgrade to provide industry-standard ESD protection during inspection.
• Xi microfocus X-ray sources with Diamond Window and open-tube design allowing replaceable filaments.
• Image enhancement including High Contrast Filter 2.0 to reveal details across high- and low-contrast areas.

Product Highlights

• Productive — rapid setup of automated inspections with Inspect-X and advanced measurement for BGAs, bond wires and complex packages.
• Safe — continuous protection via automatic collision avoidance, Low Dose Collimator and optional ESD Safety Upgrade.
• User‑friendly — vertical configuration with tilting imager and intuitive manipulator for extreme oblique views and 360° rotation.
• Premium data quality — Xi microfocus sources with Diamond Window and integrated generator for reliable operation.
• Powerful image processing — High Contrast Filter 2.0 for faster, more accurate defect analysis.

Specifications (summary)
Models — XT V 160 | XT V 130C
Maximum kV — 160 kV | 130 kV
X-ray source — Open tube with replaceable filaments (Xi microfocus) | Open tube with replaceable filaments (Xi microfocus)
High voltage generator — Integrated generator (no HV cable maintenance) | Integrated generator (no HV cable maintenance)
Feature recognition — Submicron (XT V 160) | Micron-level (XT V 130C)
Viewing angle range — Up to 82° any direction (XT V 160) | Up to 79° any direction (XT V 130C)
Sample tray — Carbon fibre tray, 580 mm diameter | Carbon fibre tray, 580 mm diameter
Cabinet dimensions (W x D x H) — 1,260 x 1,789 x 1,904 mm | 1,260 x 1,789 x 1,904 mm
System weight — 2,100 kg | 2,100 kg
ESD safety — Optional ESD Safety Upgrade (industry-standard protection) | Optional ESD Safety Upgrade (industry-standard protection)
Primary applications — Automated and real-time electronics and semiconductor inspection for R&D, QA/QC and failure analysis | Real-time electronics inspection

Industry Applications

• Electronics — defect detection in BGAs, bond wire integrity analysis, PCB batch inspection and automated pass/fail workflows.
• Semiconductor — ESD-safe inspection and low-dose workflows for radiation-sensitive devices; enhanced visibility with High Contrast Filter 2.0.
• Quality laboratories — automation, virtual cross sections (X.Tract) for detailed analysis and expanded sample handling via Heavy Duty Tray.
• Research & Development — high-magnification CT arm and enhanced imaging for development and failure analysis tasks.

FAQs (summary)

• Main benefits: improved image resolution and magnification, flexible sample handling and protection options for sensitive components (ESD and radiation control).
• Why ESD Safety Upgrade: prevents electrostatic damage to delicate devices and helps meet industry ESD standards.
• Role of Low Dose Collimator: minimises primary beam exposure and shields non-inspected areas to enable larger batch inspections.
• Suitability for electronics: designed specifically for non-destructive electronics inspection with Xi sources, Inspect-X and precision motion control.

Technical specifications

• Series / Model: XT V Series (XT V 160, XT V 130C)
• Maximum tube voltage: 160 kV (XT V 160) / 130 kV (XT V 130C)
• X-ray source: Xi microfocus, open tube with replaceable filaments
• High voltage generator: integrated generator (no external HV cable maintenance)
• Feature recognition: submicron (XT V 160) / micron-level (XT V 130C)
• Viewing angle range: up to 82° (XT V 160) / up to 79° (XT V 130C)
• Sample tray: carbon fibre, Ø 580 mm
• Cabinet dimensions (W×D×H): 1,260 × 1,789 × 1,904 mm
• System weight: approx. 2,100 kg
• Software: Inspect-X, PCB Analysis Suite; X.Tract virtual cross sections
• Image enhancement: High Contrast Filter 2.0
• Options: Low Dose Collimator, ESD Safety Upgrade, High Magnification CT Arm, Heavy Duty Tray