X-ray inspection machine XT V 160

CTPCBfor the electronics industry

Nikon’s XT V range comprises world-class X-ray and CT systems for non-destructive inspection of electronic components (PCBs, BGAs, chips and much more). With sub-micron feature recognition, the XT V system range meets today’s need for high performance, non-destructive inspection of complex electronic components. Nikon’s Xi Nanotech X-ray source paired with industry leading flat panel detectors produces best-in-class image quality, with seamless transition between 2D and 3D inspection. Superior X-Ray Source Nikon’s market-leading Xi Nanotech X-ray microfocus source is unique due to its exclusive integral generator design and unparalleled 160kV maximum energy and 20W true-target power. PCB Analysis Suite PCB Analysis Suite is capable of advanced measurement and analysis of BGA, bond wires, PTH and complex packages such as PoP on multi-layered boards, with automated pass/fail inspection and reporting. Oblique Angle Concentric Imaging Extreme oblique angle field of view up to 90°, with 360° sample rotation, maintains the region of interest thanks to intelligent software and hardware.