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- Machine for the electronics industry
- Wire bonder
- ASM Assembly Systems
High-speed wire bonder AERO CAM
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Characteristics
- Options
- high-speed
Description
Overview
The ASMPT AERO CAM Series is a thermosonic wire bonder engineered for high-throughput CMOS image sensor wire bonding. It delivers up to 30% higher UPH compared with typical Cu wire applications, supports a bonded ball size down to 22µm using 0.5 mil wire, and provides bonding accuracy of 2.0µm @ 3σ. The platform is application-ready up to 30µm and integrates ASMPT’s X-Power thermosonic bonding technology, ECP looping improvements and AeroEye intelligent monitoring for process control and quality assurance.
Features
Other configurations catering to the market
Technical specifications
The ASMPT AERO CAM Series is a thermosonic wire bonder engineered for high-throughput CMOS image sensor wire bonding. It delivers up to 30% higher UPH compared with typical Cu wire applications, supports a bonded ball size down to 22µm using 0.5 mil wire, and provides bonding accuracy of 2.0µm @ 3σ. The platform is application-ready up to 30µm and integrates ASMPT’s X-Power thermosonic bonding technology, ECP looping improvements and AeroEye intelligent monitoring for process control and quality assurance.
Features
- Up to 30% higher UPH versus typical Cu wire applications
- 22µm bonded ball size achieved with 0.5 mil wire for reduced ball footprint
- Application readiness up to 30µm for advanced package designs
Other configurations catering to the market
- AERO CAM-G
- AERO CAM-I
Technical specifications
- Series: AERO CAM Series
- Bonded ball size: 22µm
- Wire: 0.5 mil
- Bonding accuracy: 2.0µm @ 3σ
- Throughput improvement: up to 30% higher UPH vs typical Cu wire application
- Application readiness: up to 30µm
- Bonding technology: ASMPT X-Power thermosonic bonding
- Looping enhancements: ECP looping
- Quality monitoring: AeroEye intelligent monitoring system
- Application focus: CMOS Image Sensor wire bonding
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CMOS Image Sensor Solution
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