Camera pick-and-place system DALA

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Product Overview DALA is a universal pick & place system for all camera module components, delivering the precision and throughput required for next‑generation visual intelligence. Engineered to strict cleaning standards, DALA enables seamless integration in smartphone camera modules, LiDAR units and automotive vision systems. By ensuring consistent component placement and reliable interconnections, DALA helps optimize device performance and manufacturing yield. ASMPT Semiconductor Solutions supplies this system as part of its advanced packaging and module assembly portfolio.

Features

• Universal pick & place system for camera module components
• Consistent quality via optimized production workflows
• Class-leading precision and speed
• Engineered for factory automation and inline integration
• CE mark ready

Technical specifications

• Product type: Universal pick & place system for camera module components
• Applications: Smartphone camera modules, LiDAR, automotive vision systems
• Design: Rigorous cleaning standards to minimize contamination
• Performance: Class-leading precision and throughput
• Quality: Process controls for consistent output
• Automation: Ready for factory automation and integration
• Regulatory: CE mark ready
• Manufacturer positioning: Precision powerhouse for next-generation visual intelligence (ASMPT Semiconductor Solutions)