High-speed wire bonder 8100

automatic

The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the next generation of fine wire bonders. Large complex hybrids HB/HP LED arrays Optoelectronic packaging Chip-on-board (COB) System in packages (SiPs) Specialty lead frames Automotive assemblies Flex circuits Multi-chip modules (MCMs) Fine pitch devices LEDs with running stitch VisionPilot® Utilizes advanced geometric pattern matching technology to reliably and accurately locate parts that are randomly oriented or have greyscale variations by using a set of boundary curves that are not tied to a traditional pixel-grid. Maximizes throughput, and enables part inspection both before and after bonding. Bond Data Miner A comprehensive and centralized data management and analysis system that provides machine and process trend monitoring, storage and traceability of data across platforms, and closed loop process control for increased yields and predictive maintenance. Intelligent Interactive Graphical Interface® - i2Gi® Supports advanced wire bond control through an intuitive interface that simplifies programming and provides real time graphical feedback to the user of bonding performance. Allows for a connected view with the ability to overlay 1:1 scaled graphics on top of live video of actual part.