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Power: 5, 10 W
X travel: 65 mm - 205 mm
Y travel: 65 mm - 205 mm
... Overview
The LW2 is a medium automated laser
marking station for permanent
marking, suitable for single units, small batch production and integration into robotic cells. Compatible with Fiber, MOPA, Hybrid and ...
Power: 10, 5 W
X travel: 575 mm
Speed: 157.48, 4,000 in/s
... production environments.
Key benefits
- Large marking capacity: standard marking area 300 x 300 mm, ZX bridge option extends X stroke to enable effective marking up to 875 x 300
Power: 30, 60 W
X travel: 65 mm - 205 mm
Y travel: 65 mm - 205 mm
... contrast and precision marking - Fast marking speed - Suitable for demanding industrial environments - Flexible integration for various production lines ✅ PERFORMANT With power outputs of 30W and 60W, ...
Power: 0 W - 5 W
... is applicable to 8-inch and above wafers. • Picosecond light sourceis used, good effect Picosecond light source is used to mark / code on the material surface, with small thermal impact and good effect • Marking ...
Power: 5 W
X travel: 150 mm
Y travel: 150 mm
... semiconductor industry, the wafer manipulator and external coaxial vision positioning technology are adopted to realize the full-automatic laser marking of 2-6 inch wafers. Product advantages: • High ...
Power: 20 W
X travel: 200 mm
Y travel: 200 mm
... polycrystalline silicon solar battery (cell) and silicon ( wafer) of scribing processing (cutting section). Perfect Laser produced a new generation of 20w 50W Solar cell fiber cutting machine mainly used for metal and ...
Power: 20 W
X travel: 200 mm
Y travel: 200 mm
... Full-enclosed Type Fiber laser silicon wafer cutting machine with Dust-proof PE-20W/50W (II), the biggest difference between the first generation is that this laser scribe machine is fully enclosed design, ...
Power: 10, 7, 5, 3 W
X travel: 150, 300, 200, 110 mm
Y travel: 150, 200, 300, 110 mm
... industrial working condition. It can be integrated on production line marking for production date, S/N number etc. It can mark and engrave all materials. Suntop Laser UV laser marking machine ...
... standard CAD line fonts, customizable extensions. 8. Production line speed /minimum marking line width:＜80m/min / 0.04mm 9. Marking line/ Character size:Adjustable in marking range 10. ...
Power: 0.02 kW - 0.2 kW
X travel: 100 mm
Y travel: 100 mm
... Product overview
The TH-FLMS series laser
marking
machines deliver permanent
markings on plastic buttons, electronic devices, chips, colored paper and packaging. Available models include fiber ...
Power: 3 W
X travel: 110 mm - 175 mm
Y travel: 110 mm - 175 mm
... textiles, chips, ceramics, semiconductor wafers, IC chips, sapphire, polymer films and other special materials marking, cutting and processing, such as metal marking, plastic marking, ...
... Friendly HMI 3. Imported double-head 20W fiber laser marking system; the green laser, UV laser, CO2 laser and other laser sources are optional 4. With special fume removal device, it can quickly extract the fume and ...
Han's Laser Technology Co., Ltd
Power: 175 W
X travel: 175 mm
Y travel: 175 mm
... Fiber/CO2/3W 5W UV Laser Marking Machine/Laser Printer/3D Logo Printing Machine/Laser Engraving Machine for Metal/Jewelry/Plastic/Glass It can provide stable power output,perfect optical ...
HG Star Technology
Power: 3, 5, 10, 15 W
X travel: 110, 150, 200 mm
Y travel: 100, 150, 200 mm
... The mini fiber laser marking machine offers a complete solution for fast speed marking and high precision on metal and some nonmetal materials such as some hard plastics.The mini fiber laser marking machine ...
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