Laser marking machine

glassmarblewafer

For the pan semiconductor and 3C industries, it is applied to various types of identification of Si, Gan, SiC, glass and surface coating materials, and is applicable to 8-inch and above wafers. • Picosecond light sourceis used, good effect Picosecond light source is used to mark / code on the material surface, with small thermal impact and good effect • Marking / coding support multiple formats Support various formats: QRcode, dmcode, line text and other formats • Support information uploading Equipped with code reading module to support information uploading to MES system • High compatibility and automation The equipment is compatible with 8-12inch wafers, fully automatic loading and unloading •Automatic switch, saving labor Equipped with load mechanism, which can automatically open / close the wafer cassette •Marble base, high stability Marble base, stable optical path system, thus ensuring high-quality optical transmission