Rotary blade cutting machine

for monocrystalline siliconfor glassfor ceramics

This equipment is mainly developed for semiconductor and 3C industries. Suitable for cutting silicon, ceramics, glass, SiC and other materials. It has the advantages of fast cutting speed and high positioning accuracy. The equipment is equipped with a high-precision CCD vision system, which can realize the automatic positioning and angle adjustment of the workpiece and improve the processing efficiency. • Small size The appearance size and the floor area are small, and the cutting stroke is large. • High efficiency High power spindle, high-speed and high-precision motor, closed-loop motion control to ensure production efficiency. • Complete detection Equipped with NCS, knife mark, edge collapse and cutting path position detection function •Fullly featured It is equipped with data management, alarm recording and log management functions. Applications： Semiconductor industry 3C industry