Thickness measuring system

opticalfor wafers

Facing the raw material production enterprises in the upstream of the semiconductor industry chain, the independently developed spectral confocal measurement system is used to detect the size and flatness of semiconductor raw and epitaxial wafers. Product advantages: Wide application range Used for 4-8 inch original wafer, substrate and epitaxial wafer of various materials and polishing conditions High measurement accuracy Thickness range: 0-1mm measurement accuracy: ± 1 μ M repetition accuracy: 0.2 μ m Short measurement time Measurement time: 30s / PCS (according to the customer's detection trajectory)