Camera inspection system

automaticfor defect detectionfor wafers

For the mid stream wafer manufacturing enterprises and downstream packaging and testing enterprises in the semiconductor industry chain, a multi-channel bright and dark field parallel detection system developed independently is adopted to detect the appearance defects of semiconductor wafers and grains with graphics. Product advantages: Available in a variety of sizes This equipment can be used for 4-8 inch patterned wafers Can detect a variety of defects Detect defects such as scratch, back collapse, color difference, crack, scratch, metal residue and metal loss High precision resolution System resolution: 0.2-0.8 μ m Fast detection speed Patterned wafer: 15 minutes / wafer when the number of defects is less than 200