Automatic slotting machine

This equipment is designed for 8-inch and above chip sealing and testing plants, and is applied to low-k wafers and silicon-based Gan wafers with 40nm and below in the semiconductor industry. • High quality Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position • High efficiency Based on spatial light modulation technology, the size and shape of the shaping spot can be adjusted, and the laser energy utilization rate is high and the response is fast • High integration Integrated protective liquid coating, wafer slotting and cleaning module