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Laser cutting machine LUD series
waferfor processing industrywith automated loading

Laser cutting machine - LUD series - Farley Laserlab - wafer / for processing industry / with automated loading

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Go to the Farley Laserlab website for more information

Characteristics

Technology: laser
Product handled: wafer
Applications: for processing industry
Workpiece loading: with automated loading
Phase: single-phase
Other characteristics: automatic, high-precision, high-speed, high-efficiency
X travel: 200 mm
(7.87 in)
Y travel: 300 mm
(11.81 in)
Repeatability: 2 mm, 5 mm
(0.0787 in, 0.1969 in)
Overall length: 1,150 mm
(45 in)
Maximum width: 800 mm
(31 in)
Height: 1,700 mm
(67 in)
Weight: 1,000 kg
(2,204.62 lb)

Description

Nanosecond laser is used for precise dicing of GPP wafers. Product advantages: • High processing quality The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ 30 ± 5 μm) , small edge collapse ≤ 10 μm • High processing efficiency UPH ≥ 15 (take 40mil, 5-inch GPP wafer as an example, including automatic loading and unloading) • Good processing stability Nanosecond laser has high power stability and good beam quality (M ² < 1.5)