Eutectic die bonder NANO

for die-attachflip-chipsub-micron

Product Overview
ASMPT AMICRA’s die bonding solution for the photonic and microelectronic assembly market combines vision-driven placement with in-situ AuSn eutectic bonding. The NANO platform integrates four fixed high-resolution imaging systems mounted on granite, a dynamic alignment system, and high-resolution motion control on a vibration-damped granite structure. A fiber laser is used as the primary heat source for AuSn eutectic bonding, enabling high-speed eutectic processes while maintaining placement repeatability.

Features

• Supports ± 0.2 µm* @ 3σ placement accuracy
• Suitable for Die Attach and Flip Chip applications
• High-precision alignment optics and dynamic alignment system
• Vibration damping system with granite base
• Automatic Placement Offset Tuning System
• High-resolution 300 mm bonding station
• In-situ eutectic bonding capability with fiber laser heating
• Three heating options including laser soldering system for AuSn
• Epoxy stamping and dispensing capability
• UV curing capability at the bond station
• Post-bond inspection and wafer mapping software
• Integrated clean room environment with HEPA filter and ionizer
• Modular machine concept for process flexibility

Technical specifications

• Placement accuracy: ± 0.2 µm @ 3σ (performance depends on package and materials)
• Application types: Die Attach, Flip Chip
• Alignment: High-precision optics; Dynamic Alignment System
• Motion & structure: High-resolution motion control on granite with vibration damping
• Imaging: Four imaging systems fixed to granite (vision-driven design)
• Bonding station: High-resolution 300 mm station with in-situ eutectic capability
• Heating options: Three options including fiber laser for AuSn eutectic bonding
• Additional capabilities: Epoxy stamping/dispensing, UV curing at bonding station
• Inspection & software: Post-bond inspection and wafer mapping
• Environment: Integrated clean room with HEPA filtration and ionizer
• Machine concept: Modular design with Automatic Placement Offset Tuning and Quantitative Parallelism Calibration