Automatic grooving machine ALSI LASER1206

Overview
Are you looking for the perfect platform for developing new process solutions for Advanced Packaging or Power Automotive applications? ASMPT ALSI’s LASER1206 platform includes advanced laser technology that brings you to the next step of your chip manufacturing process.

Features & Benefits

• Multi-beam Advanced Laser Technology included: limited local heat load offers the best possible process quality & high die strength.
• Dicing & Grooving capability for high volume manufacturing.
• Fully automated film frame and bare wafer handling capability.
• Includes wafer coating & cleaning and wafer coating drying station.
• Clean mini-environment (Class 1000) Guarantee: closed doors between every process module.

Applications
The LASER1206 supports multiple semiconductor processes and materials:

• UV-Dicing Plus
  • Materials: Low-K, PI, Si, SiC, GaN, GaAs, TEG, BSM, Mold, DAF, NCF
  • Wafer Thickness: 20–200 µm
  • Processes: V-DOE dicing, trenching, deep scribe
• UV-USP-Grooving
  • Materials: Low-K, PI, TEG
  • Wafer Thickness: 60–800 µm
  • Processes: Trenching, grooving, deep scribe

Platform description
The fully automated ALSI LASER1206 platform handles film framed wafers or bare wafers in a clean environment. The platform eliminates thermal damage that leads to burr formation and is an essential tool as a pre-process for plasma dicing and other next generation wafer processing methods.

Technical specifications

• Multi-beam advanced laser technology to limit local heat load and maximize die strength
• Dicing and grooving capability optimized for high-volume manufacturing
• Automated handling: film frame and bare wafer support
• Integrated wafer coating, cleaning and coating drying station
• Clean mini-environment (Class 1000) with closed doors between process modules
• Supported processes include V-DOE dicing, trenching, deep scribe, grooving
• Supported materials: Low-K, PI, Si, SiC, GaN, GaAs, TEG, BSM, Mold, DAF, NCF
• Wafer thickness ranges: 20–200 µm (UV-Dicing Plus) and 60–800 µm (UV-USP-Grooving)