CNC grooving machine LASER1205 series

Advanced Laser Dicing & Grooving System The ALSI LASER1205 is a high-precision laser system designed for full-cut dicing and grooving of semiconductor wafers. Developed by ASMPT ALSI, this system integrates advanced laser technology with high-throughput capabilities, offering a reliable solution for demanding manufacturing environments. Key Benefits of LASER1205 Ultra-Precise Dicing: Positional accuracy and reproducibility of <1.5 µm Minimal Heat Impact: Heat Affected Zone (HAZ) <2 µm Narrow Dicing Width: <12 µm for multi-beam processing on 100 µm silicon High Throughput: Up to 50% faster than competing systems Flexible Material Handling: Supports Si, SiC, GaAs, Ge, DAF, Mold, and more Inline Vision & Kerf Check: Real-time monitoring “On-the-Fly” Dual Cassette & Cleaning Stations: Continuous operation with minimal downtime Applications The LASER1205 is designed for a wide range of semiconductor processes: Wafer Dicing: Thickness from 10 µm to 300 µm Grooving & Trenching: For Low-K, PI, TEG, and other advanced materials Multi-Beam Laser Processing: UV and IR configurations Inline Vision & Monitoring: Ensures consistent quality and precision Machine Configurations Our LASER1205 laser machines are leading in quality and lower your Cost of Ownership. Our portfolio is addressed to the specific challenges of the markets, both for OSAT and #1 IDM companies.