Bonding system FIREBIRD

Overview
Automatic thermo-compression bonding system designed for heterogeneous integration in 2D, 2.5D and 3D formats.

Features

• Flexible materials handling capability for heterogeneous integration in 2D, 2.5D and 3D format
  • Co-exist die input from both wafer and tape & reel
  • Field configurable for strip / singulated / wafer substrate
  • Ultra wide carrier handling for singulated substrate
  • Direct wafer and glass substrate handling with SlimFEM
• Reliable with solid installation bases
  • >500 installations in mass production
• Innovative process
  • Inert environment enables Liquid Phase Contact (LPC) process for high productivity
  • Real-time active tip tilt

Technical specifications

• Product family: FIREBIRD Series
• Technology: Automatic thermo-compression (thermo-compression bonding)
• Target applications: Heterogeneous integration in 2D, 2.5D and 3D formats
• Material handling: Supports die from wafer and tape & reel; configurable for strip, singulated, wafer substrates
• Carrier handling: Ultra-wide carrier handling for singulated substrates
• Wafer/glass handling: Direct handling with SlimFEM
• Process environment: Inert environment enabling Liquid Phase Contact (LPC) for high productivity
• Process control: Real-time active tip tilt
• Production maturity: More than 500 installations in mass production