High-accuracy die bonder 130N

InduBond® 130N is a new generation of the inductive bonding machines by Chemplate for layer to layer pin registration and bonding the stack-up of inner layers and prepregs of a multilayer printed circuit. This process allows to laminate the multilayer boards without the needs of the pins and hard tooling plates. The process allows repeatability and reliability obtaining high registration precision between the inner layers (Tooling template accuracy <10 microns). The multilayer stack, previously mounted on a tooling template with high-precision mechanical pins, is bonded by InduBond® technology using 4 InduBond® heads (optional, 6 heads), which uniformly press and heat the bonding spots in all the inner layers until the prepreg resin is fused, thereby guaranteeing the bonding of multilayer stacks of up to 10-mm thick. The tooling plate is customize, could be 2 round pins, 3 round pins, multi round pins, 3-4 slot pins or a combination; the tooling templates are light and removable (not fixed to the machine). The resulting bonding spots are flat, without over-thickness. They are capable of withstanding the dilations and shrinkage of the hot press cycles, thereby providing the best possible linear movement of all layers in a multilayer stack-up, reducing the internal stress that cause warping and deformations and moreover, reducing the distortions and misalignments between inner layers. Technical Requirements A high precision tooling template with mechanical pins is used for the lay-up and registration. The inner layers must first be prepared with the corres- ponding registration holes (See Figure 1). These holes are generally drilled or punched post etch.