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Placement accuracy: 0.2 µm
... Product Overview
ASMPT AMICRA’s
die bonding solution for the photonic and microelectronic assembly market combines vision-driven placement with in-situ AuSn eutectic bonding. The NANO platform integrates four fixed high-resolution ...
Placement accuracy: 0.3 µm
... Automated Prototype2Production Bonder The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications ...
Finetech
Placement accuracy: 0.5 µm
... overview at all times, even when working in the sub- micron range. The table top die bonder FINEPLACER® lambda 2 shares a common module range and innovative operating software with ...
Finetech
Placement accuracy: 0.5 µm
... Semi-automated Sub- Micron Bonder The FINEPLACER® sigma combines sub- micron placement accuracy with a 450 x 150 mm working area and bonding forces up to 1000 N. The ...
Finetech
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