High yield and process stability
Minimized cost of ownership
Compliance with COD targets
Advanced machine and wafer cleanability
Traceless cleansing of coolant in preparation for texturization
No foaming (no defoamer required)
Compatible with next generation processes (e.g. reduction of wire diameter or wafer thickness, increased throughput)
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.