GPU PC GM-1100

embeddedwall-mountedDIN rail

Overview
The GM-1100 is a compact, rugged embedded MXM GPU computer designed for high-performance edge computing. It combines up to 65 W TDP Intel® Core CPUs with a 1x MXM 3.1 GPU expansion socket and a variety of I/O and storage options for constrained installations.

Key product features

• Supports Bartlett Lake-S / Raptor Lake-S Refresh / Raptor Lake-S / Alder Lake-S Intel® Core platforms (up to 65 W TDP).
• 1x MXM 3.1 Type A/B GPU module expansion socket for scalable GPU performance.
• High-speed I/O: 1x 2.5GbE LAN, 1x 1GbE LAN, 1x 20Gbps USB3.2 Gen2x2 Type-C, multiple USB3.2 Gen2/Gen1 Type-A ports.
• Multiple M.2 slots and 2x front-accessible 2.5" hot-swap SATA bays for NVMe/SATA storage and wireless/5G/GNSS modules.
• Wide input voltage (9–48 VDC) and optional CMI/CFM modules for additional I/O and power ignition sensing.
• Wide operating temperature range and certifications for rail/vehicle and rugged environments.

Design highlights

• Compact unibody extruded-aluminum chassis (260 x 200 x 85 mm) with heavy-duty metal reinforcements for mobile and vehicle installations.
• Fanless main design with optional external fans; separate heat paths for CPU and MXM GPU; external fan support via 4-pin terminal connectors.
• Robust power protections (reverse input, over-voltage, over-current) and SuperCap CMOS backup.

Applications

• Edge AI inference and training in space-constrained locations.
• Mobility and transportation systems (rail, vehicle) requiring certified rugged hardware.
• Industrial automation, machine vision, intelligent machines and other harsh-environment compute tasks.

Certifications

• EN 50121-3-2
• MIL-STD-810H
• EN 62368-1
• EN 45545-2
• CB, UL, E-Mark, CE, UKCA, FCC, ICES-003 Class A

Technical specifications

• Model: GM-1100
• Chipset: Intel R680E
• CPU support: Bartlett Lake-S, 14th/13th/12th Gen Intel® Core (P-core and hybrid variants), up to 65 W TDP.
• Memory: 2x DDR5 SO-DIMM, up to 96 GB, Un-buffered and ECC support.
• Graphics: Integrated Intel® UHD Graphics (varies by CPU); 1x MXM 3.1 Type A/B socket for discrete MXM GPU modules.
• Display: 1x DisplayPort, 1x HDMI, 1x VGA (resolutions vary by GPU/CPU).
• I/O: 1x 2.5GbE (Intel® I226), 1x 1GbE (Intel® I219); 1x 20Gbps USB3.2 Gen2x2 Type-C; multiple USB3.2 Gen2/Gen1 Type-A; 4x RS-232/422/485 (DB9).
• Storage/expansion: 2x 2.5" front hot-swap SATA bays (up to 15 mm); M.2: Key M 2280, Key E 2230, Key B 3042/3052, 2x Key B 2242.
• SIM: 2x SIM sockets; RAID: 0/1/5/10 support.
• Power: 9–48 VDC input (2x 3-pin terminal blocks), max measured consumption ~188 W (35W CPU) / ~259 W (65W CPU) under test conditions.
• Environmental: Operating temp down to -40°C up to 70°C (dependent on CPU TDP and cooling); MIL-STD-810H shock & vibration.
• Dimensions & weight: 260 x 200 x 85 mm; 4.73 kg. Mounting: Wall / Side / DIN-RAIL / VESA.
• OS: Windows 10/11, Ubuntu Desktop 22.04 LTS.