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  4. Cincoze Co., Ltd.
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Box PC MD-3000
embeddedwall-mountedDIN rail

Box PC - MD-3000 - Cincoze Co., Ltd. - embedded / wall-mounted / DIN rail
Box PC - MD-3000 - Cincoze Co., Ltd. - embedded / wall-mounted / DIN rail
Box PC - MD-3000 - Cincoze Co., Ltd. - embedded / wall-mounted / DIN rail - image - 2
Box PC - MD-3000 - Cincoze Co., Ltd. - embedded / wall-mounted / DIN rail - image - 3
Box PC - MD-3000 - Cincoze Co., Ltd. - embedded / wall-mounted / DIN rail - image - 4
Box PC - MD-3000 - Cincoze Co., Ltd. - embedded / wall-mounted / DIN rail - image - 5
Box PC - MD-3000 - Cincoze Co., Ltd. - embedded / wall-mounted / DIN rail - image - 6
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Characteristics

Type
box
Configuration
embedded, wall-mounted, DIN rail
Processor
Intel® Pentium® G7400TE, Intel® Celeron® G6900E, Intel® Core™ i9-12900TE, Intel® Celeron® G6900TE, Intel® Core™ i5-13500T, Intel® Pentium® G7400E, Intel® Core™ i5-14400, Intel® Core™ i9-12900E, Intel® Core™ i7-13700TE, Intel® Core™ i5-13500TE, Intel® Core™ i3-12100, Intel® Core™ i7-13700E, Intel® Core™ i9-13900, 12th Generation Intel® Core™, Intel® Core™ i3-13100E, Intel® Core™ i5-13400E, Intel® Core™ i3-13100, Intel® Core™ i3-12100TE, 13th Generation Intel® Core™, 14th Generation Intel® Core™, Intel® Core™ i5-12400, Intel® Core™ i5-14500, Intel® Core™ i5-13500E, Intel® Core™ i3-13100T, Intel® Core™ i9-13900TE, Intel® Core™ i5-14400T, Intel® Core™ i7-12700E, Intel® Core™ i7-13700T, Intel® Core™ i7-12700TE, Intel® Core™ i3-14100, Intel® Core™ i7-14700T, Intel® Core™ i5-12500TE, Intel® Core™ i5-14500T, Intel® Core™ i9-14900T, Intel® Core™ i3-12100E, Intel® Core™ i3-13100TE, Intel® Core™ i9-13900E, Intel® Core™ i7-14700, Intel® Core™ i5-12500, Intel® Core™ i5-12500E, Intel® Core™ i9-14900, Intel® Core™ i3-14100T
Ports
DisplayPort, DDR5 SO-DIMM, RS-232, RS-485, RJ45, RS-422, USB 3.2, SATA III, M.2, NVMe, RAID
Operating system
Linux® Ubuntu™, Windows 10, Windows 11
Motherboard format
ATX
Size
compact
Domain
industrial, machine vision, for harsh environments
Protection level
shockproof
Other characteristics
SSD, modular
Memory
96 GB

Description

Overview
  • The Cincoze MD-3000 is a compact DIN-rail embedded computer engineered for machine vision, vision-guided robotics and smart manufacturing workstations. It combines desktop-class Intel® Core™ CPU support with a 150 mm high form factor for space-constrained industrial cabinets.
  • Designed for industrial deployments with wide operating ranges, front-accessible I/O and robust mechanical construction for reliable continuous operation.


Key Product Features
  • Supports Intel® BTL‑S / 14th / 13th / 12th Generation Intel® Core™ platforms (select SKUs, 35–65 W TDP).
  • Scalable expansion via optional Scalable Expansion Deck (SED) — available in 2-, 4- and 6-slot variants to host Scalable Expansion Modules (SEMs) for I/O, PoE, M.2 and 2.5" storage.
  • Compact DIN-rail / wall-mountable design (150 mm height) with front-access operation and maintenance.
  • Dual PCIe x4 NVMe SSD support with RAID 0/1/5/10 and hot-swap-capable SEM storage modules.


Certifications (presented on product page)
  • EN 61000-6-2
  • EN 61000-6-4
  • EN 62368-1
  • CB
  • UL / cUL


Additional highlights
  • Performance: Up to 96 GB DDR5 (5600 MHz), support for dual NVMe SSDs and a wide selection of CPU SKUs for compute-intensive vision and AI workloads.
  • Thermal options: Patented Dynamic Thermal Mechanism, external fan option for dust-free cooling, and Smart OTP monitoring for fan and temperature (patents I893729, I870277).
  • Comprehensive I/O: Native high-speed and industrial interfaces plus multiple M.2 slots; flexible SEM library includes Ethernet, 10GbE, PoE, USB, COM, isolated DIO and M.2 carrier modules.
  • Installation & serviceability: Front-access connectors, cableless/jumper-less design and guiding-rail alignment for tool-less SEM installation.
  • Industrial readiness: Wide temperature (-40°C to 65°C depending on CPU TDP), wide voltage input (9–48 VDC), industrial EMC and safety compliance.


Specifications
  • Model Name: MD-3000 (Cincoze)
  • Processor: Supports Bartlett Lake‑S (BTL‑S), 14th/13th/12th Gen Intel® Core™ SKUs (select P‑core and hybrid variants); supported TDP range 35–65 W depending on SKU.
  • Chipset: Intel R680E
  • Memory: 2x DDR5 SO‑DIMM, Unbuffered / ECC support, up to 96 GB (5600/5200/4800 MHz dependent on CPU class).
  • Graphics: Integrated Intel® UHD Graphics (model varies by CPU). Dual independent DisplayPort outputs (2x DP).
  • I/O: 5x GbE RJ45 (Intel® I219 / I210), 1x RS-232/422/485 (DB9, Auto Flow Control, 5V/12V), 4x USB 3.2 Gen1 Type-A.
  • Storage & expansion: 2x M.2 Key M 2280 (PCIe Gen3 x4; one supports PCIe/SATA), 1x PCIe x16 for optional SED.
  • RAID: NVMe RAID 0/1/5/10
  • Power: 9–48 VDC input (3‑pin terminal), AT/ATX mode switch, ATX power button, remote power on/off connectors. Measured max power: ~195.2 W (35 W CPU) / ~279.4 W (65 W CPU) under test conditions.
  • Physical: 135.5 x 132 x 152.2 mm (W x D x H), weight ~3.03 kg, extruded aluminum chassis, DIN-rail / wall mount.
  • Reliability: Reverse power input protection, over-voltage and over-current protection, SuperCap CMOS backup, MTBF ~356,683 hours (Telcordia SR-332).
  • OS support: Windows® 11 / 10, Linux (Ubuntu 22.04).
  • Environment: Operating temperature varies by CPU TDP (35W: -40°C to 65°C; 45W: -40°C to 55°C; 65W: -40°C to 45°C). Storage: -40°C to 85°C. Shock & vibration and EMC per industrial standards.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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