3D inspection system CA20

X-rayautomatedfor the packaging industry

• Designed for the semiconductor industry • Non-destructive technology for three-dimensional insights into solder bumps within minutes • Repeatable results through reliable and accurate technology, designed to support a stable inspection routine • Efficient software-assisted review including automated void analysis with Void Insights • Dose Manager for the protection of X-ray sensitive components CA20 – The fastest way from R&D to ROI The semiconductor sector is a speed-driven industry. In the race for innovation every day counts. As an inspection system specifically developed for the challenges of complex 3D ICs in Advanced Packaging, the CA20 helps you keep the pace – and to stay ahead of the game. The CA20 enables an accelerated verification of new packaging process node prototypes: The faster you find the root cause of ramp-up issues and fix them, the faster you’ll reach the desired yield – and, thus, the Return-on-Invest (ROI). Our innovative software solutions • The CoS 3D Clarity package as part of our award-winning Geminy software is your tool to quickly create high resolution 3D images. • Use our Batch Manager to inspect trays of ICs or substrate strips with a few clicks. • Protect your sensitive inspection parts from critical X-ray doses with the Dose Manager. CA20 inspection applications in R&D and production • Chip-on-Substrate including Fan Out packaging solder connections (C4 bumps and copper pillars) • 2.5 and 3D IC package solder connections including microbumps • Substrate strip solder bumps • Sensors • MEMS and MOEMS