Thermal interface material FUJIPOLY

Thermal interface materials (Fujipoly) Materials Silicone load with metallic particles (Boron nitrite, aluminum oxide, zinc oxide, aluminum or silver) or ceramic particles MANUFACTURING PROCESS Mixing silicone and particles then cut the sheets Prototyping Die cutting or custom cut with xy cutting table Conductivité: ≤ 17w/m.K Hardness On request, depending of the material Options Adhesive, hardened side, fiberglass matrice Packaging Sheets or reel for automatic application. Description Thermal interfaces avoid air (insulator) between the heatsink and the CPU, GPU, processor. It creates a bridge between a hot and a cold point. Performance depends of the particle charge into the silicone interface. Complema is the European representative of Fujipoly. For more information, please visit our partner FUJIPOLY website for their SARCON® product line. Thermal interfaces are cut according to your drawings and are available in sheets or rolls depending on their dimensions. Our range consists of three main families: silicone base, silicone free and graphite. Silicone base Ultra Soft with a thermal conductivity ≤ 17w/m.K These interfaces are produced by a polymer matrix charged with thermal conductive particles. They adapt themselves to component’s reliefs on a PCB. Silicone free with a thermal conductivity ≤ 3W/m.K These interfaces have similar functions to the silicone interfaces but they don’t present any risk of outgassing and bleeding oil in sensitive environments (hard disks, optical components, etc.)