Ultra Soft thermal interfaces
Materials
Silicone interface mixed with conductive particles
MANUFACTURING PROCESS
Entire sheet or die cut (according to your drawing)
Particle load
Boron nitrite, aluminum oxide, zinc oxide, aluminum or silver
Prototyping
Ask for a custom cut for sample
Conductivité:
≤ 17 W/m.K
Hardness
< 25 Shore 00
Options
Fiber glass, Hardened side, thickness : ask us for your project
Packaging
Sheets or reels.
Description
A thermal interface material transfers the heat from a hot to a cold point.
Its remove the air zones between the hot surface and the heatsink (air is insulating).
Ultra Soft thermal interfaces are produced by mixing a polymer material with thermal conductive particles (mostly metallic).
Its adapt to the reliefs of your electronic card (PCB) and fit your CPU and GPU.