Ceramic substrate

thick-film

CoorsTek developed the standards for thick-film ceramic substrates and continues to provide economical yet durable substrates for hybrid integrated circuits, surface mount devices, sensors, and other thick-film electronics. We help you design a thick-film ceramic substrate tailored to your application: Material selection Size & thickness Tolerancing Laser machining & scribing Edge finishing Inspection & special requirements Why Ceramic Thick-Film Substrates? ALUMINA Alumina is the material of choice for most thick-film ceramic substrates — delivering durable, cost-effective performance for hybrid electronic circuits with proven reliability. CoorsTek has engineered different grades, formulations, and thicknesses to provide an optimal fit for a variety of applications. ALUMINA THICK-FILM SUBSTRATES CoorsTek ADS-96R thick-film alumina substrates are the standard, particularly well suited for small-geometry, high-resistance circuitry — engineered to minimize resistivity variation and maximize aged adhesion. MIDFILM® SUBSTRATES CoorsTek MidFilm substrates are compatible with etchable inks and photo-formed systems — combining high flexural strength and thermal conductivity. OPAQUE THICK-FILM SUBSTRATES For light-sensitive semiconductor device applications, use CoorsTek opaque ADOS-90R alumina material — formulated specifically to block light transmittance and absorb stray light. SUBSTRATE SIZE AND THICKNESS Substrate Thickness (Alumina) - Thick-film substrate thicknesses range from 0.381 mm to 2.54 mm. The most common thicknesses range from 0.635 mm to 1.016 mm. Minimum hole diameters are based on thickness.