Optical connector MMC®

multi-channel fiber opticblind matehigh-density

Overview
Corning presents the MMC® Connector platform for Very Small Form Factor (VSFF) high-density deployments. The solution offers compact 16–32‑fiber interfaces that can provide up to ~3× the port density of standard MPO in the same footprint, enabling efficient rack-space utilization and scalable expansion for hyperscale AI data centers and other high-performance computing environments.

Key Product Details

• High-density MMC connectors delivering increased fiber ports per footprint versus standard MPO solutions.
• Ganged MMC configurations enabling simultaneous removal/insertion of modules to accelerate installation and servicing.
• PRIZM® TMT ferrule variants with lens-based expanded beam interface for passive alignment, improved debris tolerance and blind-mate capability.
• Compatibility with Corning® Multicore Fiber solutions to further boost fiber counts in constrained spaces.
• Target applications: hyperscale AI data centers, high-performance computing, co-packaged and near-packaged optics architectures.

How the MMC® Connector Works
The MMC® platform uses a TMT ferrule format derived from MT and MT‑16 ferrules and incorporates precision alignment features designed for repeated insertion cycles. Technical highlights include:

• Precision shoulder design for mechanical alignment and durability.
• 250‑micron pitch with compatibility for 250‑, 200‑ and 165‑micron fiber types.
• Intermateability with MT and MT‑16 formats.
• Low insertion loss options for single‑mode APC and multimode APC implementations.

Ganged MMC Connector Benefits

• Compact mechanical layout with precision alignment to reduce installation time.
• Higher port density and significant size reduction compared with some MPO implementations.
• Simultaneous module removal/insertion to simplify field operations in high-density panels.

PRIZM® TMT Connector
The PRIZM® TMT option provides an expanded‑beam, lens‑based ferrule for enhanced debris tolerance, passive alignment and blind‑mate connectivity—suitable for evolving manufacturing and deployment models in next‑generation optics.

Usage & Applications

• Hyperscale AI data centers
• High‑performance computing (HPC)
• Co‑packaged optics (CPO) and near‑packaged optics (NPO) architectures

FAQs (condensed)

• MMC vs MPO: MMC can deliver up to ~3× the port density of standard MPO in an equivalent footprint.
• Fiber counts: supports 16–32 fibers per connector.
• PRIZM TMT: expanded‑beam ferrule option for debris tolerance and blind‑mate.
• Typical use: designed for high‑density optical deployments in AI and HPC environments.

Technical specifications

• Supported fiber configurations: 16 to 32 fibers per connector.
• Ferrule format: TMT ferrule (PRIZM® TMT available as expanded‑beam option).
• Pitch: 250‑micron pitch.
• Fiber compatibility: 250‑µm, 200‑µm, 165‑µm fibers.
• Intermateability: compatible with MT and MT‑16 formats.
• Performance: low insertion loss options for single‑mode APC and multimode APC.
• Mechanical: precision alignment shoulders for repeated insertions/extractions.
• Density advantage: up to ~3× port density vs. traditional MPO within equivalent footprint.
• Packaging: ganged MMC connectors for simultaneous module removal/insertion.