Cree LED’s Direct Attach™ SA1438™ LED chips are the next generation of solidstate LED emitters that combine highly efficient InGaN materials with Cree LED’s proprietary device technology to deliver superior value for the general illumination and automotive exterior markets. The SA1438 LED chips are among the brightest in the market at a low forward voltage, resulting in a very bright and highly efficient solution. The bondpad-down design allows for eutectic die attach, eliminating the need for wire bonds, enabling superior performance, improved thermal management and high reliabilty. The design is optimally suited for industrystandard top-view packages.
FEATURES
• Direct AttachTM LED Technology,
no wire bonding
• High Reliability - Flux Eutectic Attach
• Junction-Down design minimizes Rth
for Improved Thermal Management
• Direct Attach LED RF Performance:
– 450 nm – 30+ mW
– Low Forward Voltage (Vf
)
– 2.9 V Typical at 20 mA
• Maximum DC Current (If
) – 50 mA
• AuSn bond pad metal for Eutectic Attach
• 2000 V, Class 2 ESD Rating