Reflow soldering oven I.C.T LV series

PC-controllablefor electronic componentsfor automotive applications

I.C.T LV Series Vacuum reflow oven unparalleled heating performance and temperature control system meets the requirements of various welding processes. PCB Width: L500 - W400mm Quantity of cooling zones: 3(top 3/bottom 3) I.C.T LV Series Vacuum reflow oven unparalleled heating performance and temperature control system meets the requirements of various soldering processes, LV Series Vacuum Reflow Oven is high-end reflow products committed to keeping up with market demand to enhance customers competitiveness.Its new design concept fully meets the needs of increasingly diverse processes, And considering the future direction of the industry, entirely suitable for communications, automotive electronics, home appliances, computers and other consumer electronic products . Features: 1.Control System: PC + Siemens PLC control system,accurate temperature control and more stable,ensures temperature stability rate to be more than 99.99%. 2.Vacuum system:PCB directly enters the vacuum unit from soldering area. Start the vacuum process to reduce the vacuum pressure to 100mbar-5mbar. The internal gas such as pores and cavities overflows from the molten solder joint, which can reduce the void rate to less than 2%. 3.Hot air system: first-class heating module, the best temperature zone interval design makes optimum temperature uniformity and repeat.The effective utilization and thermal compensation efficiency,it needs less than 20 minutes from temperature control accuracy ± 1 ℃ ambient temperature to a temperature stabilization .