Custom circuit board

Overview
Since 2010 ds automation operates a complete production line for electronic assemblies and devices. The production setup and competencies are optimized for prototyping and small-to-medium series. Services cover development support, production, testing, logistics and technical documentation from concept to series-ready electronic products.

Service description
We manufacture, support and adapt even complex products. Production includes prototypes and series, with production-safe solutions for challenging environments (e.g. maritime electronics, vehicle electronics). The facility features flexible equipment, full component traceability by barcode and intelligent feeders that enable uninterrupted operation across changing series.

Products from production (examples)

• Acoustic sensors
• Steering sensors for forklifts
• On-board computers and communication modules for agricultural machines
• Controls for machine tools
• Maritime electronics
• Electronic noses
• Electronic name badges for hospital staff
• Time attendance terminals
• Controls for air separators

In-house manufacturing and process steps

• Prototype and sample production (from batch size ≥ 1)
• Final assembly of complete electronic devices and systems
• PCB assembly (SMD & THT) with details:
  • PCB dimensions up to 300 mm × 400 mm
  • Component sizes from EIA 01005 up to 80 mm × 70 mm
  • Supported packages: SOIC, PLCC, TSOP, QFP, BGA
  • Volumes: prototypes and small to medium series
• Reflow and vapor-phase soldering
• Solder paste stencil printing up to 23 inches
• Automated optical inspection (AOI)
• Conformal coating and protective coatings
• Potting using in-house injection molding fixtures
• Adhesive dispensing
• Cable harnessing and wiring
• Component procurement
• Dry storage for moisture-sensitive components
• Thermal processing
• ESD-compliant production
• Assembly functional testing
• Logistics / material management
• Repair services for electronics (assemblies, devices, systems)

Additional process notes
In the vapor-phase soldering process, condensation heat is applied precisely where required. This enables reliable and specification-compliant soldering of components with very different sizes and masses on a single PCB.

Characteristics / technical specifications

• Production line in operation since: 2010
• Target: prototyping, small to medium series
• Maximum PCB dimensions: 300 mm × 400 mm
• Supported component sizes: from EIA 01005 to 80 mm × 70 mm
• Supported packages: SOIC, PLCC, TSOP, QFP, BGA
• Solder paste stencil printing up to 23 inches
• Reflow and vapor-phase soldering
• Automated optical inspection (AOI)
• Potting with in-house injection molding fixture
• Dry storage for moisture-sensitive components
• ESD-compliant production
• Integrated logistics and material management