Assembly paste FluxPlus™

coppersilver basedaluminum

Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more. Unlike liquid fluxes, tacky FluxPlus can be applied exactly where needed without contaminating nearby areas. EFD provides a wide array of formulations for use in a variety of applications. • Controlled flux spread as a result of precise dispensing • Holds small parts in place before soldering • Delivers more flux compared to flux-core wire solder • Formulas for wetting to difficult-to-solder surfaces (stainless steel, etc.) • Convenient sizes: 10cc, 30cc, 55cc, and 70cc syringes; 6 oz cartridges; and 2 oz and 6 oz jars • Compatible with range of dispensing solutions, including jetting systems No Clean (NC) Consisting of rosin, solvent, and a small amount of activator, NC flux has low activity and is suited to easily soldered surfaces. NC residue is clear, hard, noncorrosive, non-conductive, and designed to be left on your assembly. Residue may be removed with an appropriate solvent. Water Soluble (WS) Consisting of organic acids, thixotrope, and solvent, WS flux comes in a wide range of activity levels for soldering to even the most difficult surfaces. WS flux residue is corrosive and should be removed as soon as possible after reflow to avoid damage to your assembly. Maximum safe time before cleaning is product dependent. Residue is easily removed with 60° C (140° F) water at 40 psi (3 bar) pressure.