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... defects in the SMT process cannot be avoided? No, that's not true. Discover GT(R)-S, the L1 all-rounder among our solder pastes. This paste guarantees optimum wetting on a wide variety of surface materials and minimizes ...
... Silver- based brazing pastes can be used to braze: Steel Copper and its alloys Nickel and its alloys Info Request They can be dispensed via automatic systems or by screen-printing. In ...
... by approx. 40%. Further, the less energy consumption contributes to lower CO2 emission. New technology keeps the solder paste from drying for stable performance in continuous use. The viscosity stability and tack time are also improved ...
Koki Company Limited
... to S1XBIG. S1XBIG is flexible solder paste which is low in Ag yet has workability as high as conventional products. Product Performance Table Product Name - S1XBIG58-M500-4 Product Category - Solder Paste Melting ...
Koki Company Limited
... "Hybrid" high reliability halogen free low Ag solder paste S01XBIG58-M500-4 Sn 0.1Ag 0.7Cu 1.6Bi + Ni Achieved joint reliability superior to SAC305 The only difference from SAC305 is "low cost" A very small amount of two modifying ...
Koki Company Limited
... powerful wetting, and high SIR Product Performance Table Product Name SB6N58-HF350 Product Category Solder Paste Composition Sn 3.5Ag 0.5Bi 6.0In Melting Point(℃) 202-210 Particle Size（μm） 20 - ...
Koki Company Limited
... True Halogen Free High Reliability Alloy Solder Paste SB6N58-HF350 Highly thermal stress resistant Halogen free (ROL0) by IPC J-STD-004B Increasing demand for high thermal stress For PCBs exposed to severe temperature fluctuation, long ...
Koki Company Limited
... sectional view (After 1500 cycles) Product Performance Table Product Name SB6N58-M500SI Product Category Solder Paste Composition Sn 3.5Ag 0.5Bi 6.0ln Melting Point(℃) 202-210 Particle Size（μm） ...
Koki Company Limited
... ■Stress strength after T/C Product Performance Table Product Name SB6NX58-M500SI Product Category Solder Paste Composition Sn 3.5Ag 0.5Bi 6.0In 0.8Cu Melting Point(℃) 202 - 204 Particle Size（μm） ...
Koki Company Limited
... Applicable for air reflow – crack free flux residue solder paste S3X58-CF100-2 Sn 3.0Ag 0.5Cu Highly reliable solder paste with "Crack-Free residue" Technology Suppresses ion migration By adopting special resin ...
Koki Company Limited
... Solder paste developed in collaboration with TOYOTA Corporation GSP Sn 3.0Ag 0.5Cu Crack-Free residue technology for reliable auto-applications No residue washing or coating required GSP's crack-free flux residue acts as a coating ...
Koki Company Limited
... a newly developed lubrication technique S3X70-G835 adopts a type of non-volatile solvent as its primary constituent, and can keep itself from drying when the paste is left idle. A better print-to-pause property results, ensuring ...
Koki Company Limited
... TAMURA ELSOLD® solder pastes feature outstanding wetting properties across a wide range of temperatures. Because of this, our solder pastes offer first-rate slump characteristics and excellent adhesive qualities. The ...
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