Solder paste S3X58-CF100-2

copper basedsilver basedfor electrical components

Applicable for air reflow – crack free flux residue solder paste S3X58-CF100-2 Sn 3.0Ag 0.5Cu Highly reliable solder paste with "Crack-Free residue" Technology Suppresses ion migration By adopting special resin into the flux, the residue remains flexible at a wider temperature range. Cracking during thermal cycling is suppressed, and ion migration due to condensation is significantly reduced. Significantly increases ICT first run rate Soft residue containing special resin reduces adsorption of flux residue onto test pins and contributes to the improvement of the ICT first run rate and application efficiencies. Passed various insulation tests for automotives In addition to typical test standards, various insulation tests specified by automotive component manufacturers has been carefully conducted. Through these tests, S3X58-CF100-2 has proven that crack-free residue achieves high electrical reliability. Product Performance Table Product Name - S3X58-CF100-2 Product Category - Solder Paste Melting Point(℃) - 217-219 Particle Size（μm） - 20-38 Viscosity（Pa.s） - 190 Flux Content(%) - 11.2 Halide content(%) - 0 Flux Type - ROL0 (IPC J-STD-004)