Solder paste E150DN

jointcopper basedsilver based

Non-contact jet dispensing applicable solder paste E150DN series Sn 3.0Ag 0.5Cu JET" brings about various advantages Consistently Deposited Solder Non-contact application of solder paste allows repeated deposition to one specific spot. Amount of solder paste is adjustable according to the size of components, thus securing high reliability at the solder joint. Stable Solder Paste Shape Configuration of dispensed solder paste is stable all the way through in jet dispensing, as the process does not involve a nozzle contact which is responsible for causing bridges. Achieves High Precision Dispensing E150DN Series wipes out concerns with jet dispensing of solder paste such as clogging of needles, solder icicle, and spattering by optimizing size of solder powder and viscosity, and adjusting thixotropy. Product Performance Table Product Name - E150DN series Product Category - Solder Paste Melting Point(℃) - 217-219 Particle Size（μm） - 58:20-38 / 70:10-25 / 811:5-20 Viscosity（Pa.s） - 40 Flux Content(%) - 15.0 Halide content(%) - 0 Flux Type - ROL0 (IPC J-STD-004A)