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Solder paste S3X58-G803

Solder paste - S3X58-G803 - Koki Company Limited
Solder paste - S3X58-G803 - Koki Company Limited
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Characteristics

Function
solder

Description

Ensures stable and ultra low voiding regardless of component type and reflow profiles Concerns with Voiding Voids remained inside the solder joint affect the joint quality in various aspects. Product Performance Table Product Name - S3X58-G803 Product Category - Solder Paste Composition - Sn 3.0Ag 0.5Cu Melting Point(℃) - 217 - 219 Particle Size（μm） - 20-38 Viscosity（Pa.s） - 200 Flux Content(%) - 11.8 Halide content(%) - 0 Flux Type - ROL0（IPC J-STD-004）

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Solder Paste

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