FemtoLux is an industrial femtosecond laser designed for maximum reliability, seamless integration, and non-stop 24/7/365 zero maintenance operation, featuring innovative 'dry' cooling. Its wide range of options enables tailoring for various material processing tasks, including ablation, drilling, cutting, and scribing.
Features- At 1030 nm: 50 W typical max output power, >300 µJ typical max output energy
- At 515 nm: 20 W typical max output power, >50 µJ typical max output energy
- At 343 nm: 10 W typical max output power, >25 µJ typical max output energy
- High energy version available (1 mJ at 10 kHz)
- >750 µJ in burst mode
- <350 fs – 1 ps pulse duration (tunable)
- Pulse duration extension up to 1 ns
- Single shot to 4 MHz (AOM controlled)
- MHz, GHz, MHz+GHz burst modes
- Pulse-on-demand (PoD), with jitter as low as 20 ns (peak-to-peak)
- <0.5% RMS power long term stability over 100 hours
- M² < 1.2
- Beam ellipticity > 0.85
- Zero maintenance
- Dry cooling (no water used)
- PSU and cooling unit integrated into single 4U rack housing
- Easy and quick installation
- Compatible with galvo and Polygon scanners as well as PSO controllers
A reliable & versatile tool for micromachiningFemtoLux is engineered for maximum reliability and seamless integration, supporting zero maintenance operation with innovative dry cooling. The tunable pulse duration from <350 fs to 1 ps and a broad AOM-controlled range of pulse repetition rates (single shot to 4 MHz) make it suitable for demanding micro-machining applications. Maximum pulse energy exceeds 300 μJ in single pulses and 750 µJ in burst mode, ensuring high ablation rates and throughput. Advanced control electronics allow simple integration with external controllers via REST API (Windows, Linux, and others), reducing integration time and resources.
Seamless user experience- Easy integration – remote control using REST API via RS232 and LAN
- Reduced integration time – demo electronics available for laser control programming
- Easy and quick installation – no water, fully disconnectable laser head, end-user installable
- Easy troubleshooting – integrated detectors and constant system status logging
- No periodic maintenance required
Application fields- Through glass vias (TGVs) manufacturing in glass
- Thin glass cutting
- Nitinol stent processing
- Microelectronics manufacturing
- Heat-sensitive polymer cutting
- Scribing of thick glasses
- Black/color marking of medical tools
Innovative “Dry” Cooling SystemThe FemtoLux laser employs a direct refrigerant cooling system, eliminating the need for bulky water chillers and associated maintenance. The refrigerant circulates from a PSU-integrated compressor and condenser to a cooling plate via armored flexible lines. The system is hermetically sealed, maintenance-free, and offers high cooling efficiency with >45% lower power consumption compared to water cooling.
Direct refrigerant cooling system features- Military-grade reliability
- Permanently hermetically sealed system (>90,000 hour MTBF)
- No maintenance
- High cooling efficiency
- >45% lower power consumption than water cooling
- Compact and light
Simple & reliable cooling plate attachmentThe cooling plate is detachable from the laser head for convenient installation. The cooling equipment is integrated with the power supply unit into a single 4U rack-mounted housing (total weight: 15 kg).
Pulse-on-Demand (PoD) Option- Jitter lower than 20 ns ensures consistent and equidistant pulse spacing for high-speed micromachining
- Adjustable repetition rate for processing complex geometries
- Faster processing speeds and increased productivity
PoD enables the laser to fire pulses only when required, improving efficiency, accuracy, and quality in micromachining. This feature is essential for high-speed, high-precision applications where equidistant pulse spacing is critical.
GHz Burst Option- Any desired intra-burst PRR can be achieved independently from the master oscillator
- Identical pulse separation inside GHz bursts
- Short- and long-burst formation modes (0.5–10 ns for short, 20–500 ns for long bursts)
- MHz+GHz burst mode
- Adjustable amplitude envelope of GHz bursts
- No pre/post pulses in GHz burst
- Ultrashort pulse duration maintained inside bursts
Patent-pending all-in-fiber active fiber loop (AFL) technology enables flexible burst formation and operation in single-pulse, MHz burst, GHz burst, and MHz+GHz burst modes.
Laser control applicationEkspla Control Application allows routine operation control via LAN or RS-232, with self-adaptive software compatible with multiple systems and platforms.
Applications- Glass: Precise fabrication by drilling, cutting, and milling of transparent materials
- Polymer: Precision fabrication with minimal thermal effects
- Metal: Complex shapes, black/white marking, and coloring without chemical additives
- Other materials: Superior precision for complex 3D and non-conventional shapes
Characteristics / Technical Specifications- Models: FemtoLux 30, FemtoLux 50
- Central wavelength: 1030 nm (fundamental), 515 nm (second harmonic), 343 nm (third harmonic)
- Pulse repetition rate: 100–200 kHz up to 2–4 MHz (model dependent)
- Average output power: up to 50 W (1030 nm), up to 20 W (515 nm), up to 10 W (343 nm)
- Pulse energy: >300 µJ (1030 nm), >50–55 µJ (515 nm), >25–30 µJ (343 nm)
- Pulse duration: tunable, <350–400 fs to 1 ps; extension up to 1 ns
- Beam quality: M² < 1.2 (typical <1.1)
- Beam ellipticity: >0.85
- Beam divergence: <1 mrad
- Beam pointing thermal stability: <20 µrad/°C
- Beam diameter: 2.5 ± 0.4 mm @ 65 cm (1030 nm)
- Polarization: vertical
- Triggering mode: internal / external
- Pulse output control: frequency divider, pulse picker, burst mode, packet triggering, power attenuation, pulse-on-demand
- Control interfaces: RS232 / LAN
- Umbilical cord: 3 m, detachable
- Laser head cooling: dry (direct refrigerant cooling through detachable cooling plate)
- Laser head dimensions: 434 × 569 × 150 mm
- Power supply unit dimensions: 483 × 534 × 184 mm
- Mains requirements: 100–240 V AC, single phase, 50/60 Hz
- Maximal power rating: 800 W
- Operating ambient temperature: 18–27 °C
- Relative humidity: 10–80% (non-condensing)
- Air contamination level: ISO 9 (room air) or better