Product DescriptionPolyMide™ is a filament from the Nylon/polyamide family. Produced with Polymaker's Warp-Free™ technology, PolyMide™ filament offers the intrinsic technical properties of nylon along with great printability.
The PolyMide™ PA6-CF is a PA6 (Nylon 6) filament reinforced with carbon fibers. The carbon fiber significantly enhances the hardness, toughness, and heat resistance of the filament, while providing excellent inter-layer adhesion.
Main Properties and SettingsRecommended Settings | Mechanical Properties | Thermal Properties | Notes
Nozzle Temperature: 280˚C – 300˚C | Young's Modulus: 7453 ± 656 (MPa) | Heat Deflection Temp. (ISO 75 1.8 MPa): 196 ˚C | Drying Settings: 80˚C for 12h
Printing Speed: 60mm/s | Tensile Strength: 105.0 ± 5.0 (MPa) | Heat Deflection Temp. (ISO 75 0.45 MPa): 215 ˚C | Recommended Support Material: BVOH
Bed Temperature: 25˚C – 50˚C (do NOT exceed 50 ˚C) | Flexural Strength: 169.0 ± 4.7 (MPa) | Melting Temp.: 220 (°C) | Other: Annealing at 80℃ for 6h
Bed Surface: any surface, covered with a thin layer of 3DLac. | Charpy Impact Strength: 13.34 ± 0.52 (kJ/m2) | |
Cooling Fan: NO | | |
We strongly recommend using an abrasion-resistant nozzle.
Integrated TechnologiesThe PolyMide™ PA6 GF benefits from Polymaker's Warp-Free™ and Fiber Adhesion™ technologies:
- The Warp-Free™ technology enables the production of Nylon filaments that can be 3D printed with excellent dimensional stability and virtually no warping. By precisely controlling the microstructures and crystallization behavior of Nylon, it allows the material to release internal stress before solidification.
- The Fiber Adhesion™ technology enhances the inter-layer adhesion of fiber-reinforced materials by optimizing the chemical surface of the fibers to achieve better dispersion and matrix bonding. This results in better strength along the Z-axis and reduces mechanical anisotropy.
Features / Technical Specifications- Family: Nylon / Polyamide
- Type: PA6-CF (Carbon Fiber Reinforced Nylon 6)
- Diameter: 1.75mm
- Color: Black
- Weight: 500g
- Technology: Warp-Free™, Fiber Adhesion™
- Recommended Nozzle Temperature: 280˚C – 300˚C
- Recommended Bed Temperature: 25˚C – 50˚C (max 50˚C)
- Recommended Printing Speed: 60mm/s
- Young's Modulus: 7453 ± 656 MPa
- Tensile Strength: 105.0 ± 5.0 MPa
- Flexural Strength: 169.0 ± 4.7 MPa
- Charpy Impact Strength: 13.34 ± 0.52 kJ/m2
- Heat Deflection Temperature (ISO 75 1.8 MPa): 196˚C
- Heat Deflection Temperature (ISO 75 0.45 MPa): 215˚C
- Melting Temperature: 220˚C
- Drying Settings: 80˚C for 12h
- Recommended Support Material: BVOH
- Bed Surface: any surface, covered with a thin layer of 3DLac
- Cooling Fan: NO
- Other: Annealing at 80℃ for 6h