Microprocessor heatsink
thermally conductive

Microprocessor heatsink - Fischer Elektronik GmbH & Co. KG - thermally conductive
Microprocessor heatsink - Fischer Elektronik GmbH & Co. KG - thermally conductive
Microprocessor heatsink - Fischer Elektronik GmbH & Co. KG - thermally conductive - image - 2
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for microprocessor, thermally conductive

Description

Active and passive heatsinks for processors The heat sinks are already mechanically adapted to the different processor types and can be attached by screw or adhesive fastening, depending on the version. Double-sided adhesive heat-conducting foils are also available in the standard range. Special designs are available on request.

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Exhibitions

Meet this supplier at the following exhibition(s):

ELECTRONICA 2026
ELECTRONICA 2026

10-13 Nov 2026 Munich (Germany) Hall B3 - Stand 243

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.