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... the heatsinks are made from one piece of material very good heat conducting aluminum material EN AW 1050 A extremely compact and high fin density for forced convection great design flexibility and ...
Fischer Elektronik GmbH & Co. KG
... the heatsinks are made from one piece of material very good heat conducting aluminum material EN AW 1050 A extremely compact and high fin density for forced convection great design flexibility and ...
Fischer Elektronik GmbH & Co. KG
... the heatsinks are made from one piece of material very good heat conducting aluminum material EN AW 1050 A extremely compact and high fin density for forced convection great design flexibility and ...
Fischer Elektronik GmbH & Co. KG
... producing and processing field. CVD Diamond is the most heat conductive material, and the heat conductivity in normal temperature is 2000WK-1 m-1, which is five times as much as cooper, even the heat ...
Delta Thermal Management Products (Coolers) provide thermal solutions for desktop computers, servers, game boxes, Telecom, household appliances and VGA cards. Delta employs highly experienced design engineers that are knowledgeable in ...
Delta Electronics, Inc.
Characteristics ●Aluminum heat sink ●DIN rail mounting TS35 ●Mounting of the SSR without mechanical processing
GTG is a highly thermally conductive foam. Ideal for applications requiring excellent thermal conductivity. Its specific formulation and load endow this silicone elastomer with exceptional thermal conductivity. Thanks to its great softness ...
Profile type - Extruded heat sink Dimensions - 34x60 mm Base thickness - 12 mm Weight - 2,84 kg/mt Thermal resistance Rth bei Natural convection - 4,3 C/W Rth bei length - 50 mm
CTX Thermal Solutions
Profile type - Extruded heat sink Dimensions - 24x20 mm Base thickness - 2,5 mm Weight - 0,54 kg/mt Thermal resistance Rth in natural convection - 12,9 C/W Rth in length - 50 mm
CTX Thermal Solutions
Profile type - Extruded heat sink Dimensions - 85x18 mm Base thickness - 4,5 mm Weight - 1,45 kg/mt Thermal resistance Rth in natural convection - 4,0 C/W Rth in length - 100 mm
CTX Thermal Solutions
Air Cooled Assemblies The most efficient way to remove heat from a large area semiconductor (>23mm silicon diameter) is to package it into a flat circular package that allows heat and current to flow ...
Liquid Cooled Assemblies The most efficient way to remove heat from a large area semiconductor (>23mm silicon diameter) is to package it into a flat circular package that allows heat and current to ...
High Voltage Assemblies Applied Power Systems produces a series of High Voltage Pulse Power Stack Assemblies for a wide range of applications. Utilizing our High Power Semiconductor Stacks, thermal management systems, High Voltage ...
Aavid Thermalloy has developed a new series of extrusions to satisfy the requirements of our customers with a view to boosting the performance of their applications. The improved extrusion process, which has been studied in cooperation ...
Aavid Thermalloy
Air-Cooled Heat SinksHigh-performance brazed aluminum heat sinks in electronics cooling, optimized for customer needs.Tight fin densityDesign flexibility with configurable componentsEfficient heat ...
AKG
Heatsink for Power LEDs from 1W and 3W; 109,90mm diameter, 54,00mm height; Standard AR111
KHATOD OPTOELECTRONIC S.r.l.
Efficient heatsinks are an essential component of any power semiconductor system and PPI have a wide range of extruded aluminium heatsinks available from stock. We can also provide heatsinks ...
Power Products International
These surfacemount heatsinks are extruded not stamped. This extruded designs are far more efficient than any stamped counterpart. One of the main issues is getting heat from the board level into the heatsink. ...
Ohmite
The FHS-090 Series of integrated-fan heat sinks is uniquely designed to absorb and disperse heat away from high temperature devices while offering key features such as an operating temperature ...
... SSR's dissipate heat during switching. When using an SSR this problem of heat dissipation must be managed. It is very important to select the correct heatsink to allow maximum performance ...
... surface. The package also includes heat transfer pads to ensure the efficiency of the cooling. It was designed for Raspberry Pi 3 but on request we can make for any other devices. Installing Place the heat ...
Levtech Service Production SRL
D6 manufactures a line of dual fan forced air cooling assemblies. These assemblies are designed to accommodate two 120mm fans. Many standard lengths are stocked, while custom lengths can be manufactured in as little as 3 – 4 weeks ...
D6 Industries, Inc.
PRODUCT FEATURES Air-cooled heat sink Material:6063-T5 Technology.compression joint The structure is flexible, which can be made customized APPLICATION Widely applied in UPS,High voltage inverter,wind ...
Rongtech Industry (Shanghai) Inc.,
1. Air Cooling Heatsink for modules only 2. Outlook Code 3. Length(mm)
... for bigger parts. Description Heatsinks are mechanical parts made of standard or specific profiles. It is used for thermal management of electric components of any sizes (mainly cooling). It dissipates heat ...
... head must be attached to a heatsink providing good thermal resistance. This value is the difference between the maximum operating laser base plate temperature (50˚C) and the maximum ambient temperature at the air-heatsink ...
... (within 0.05 mm over mounting surface). It is recommended to use a thermal heat compound between the laser head and the heatsink to provide good thermal contact. The heatsink superceeds ...
CUSTOM HEAT DISCHARGE We offer heat sink solutions to automotive and industrial standards. Our performance portfolio comprises aluminium pressure casting, adjustment and testing of surface qualities, ...
A heat sink cools electronic components and power semiconductors to avoid damage from overheating. The component is attached to the metal sink whose fins facilitate heat dissipation by convection.
ApplicationsThese devices are used in electronics to cool processors and power and amplification circuits.
TechnologiesVertical orientation is preferred in the case of passive convection. A fan can be added if necessary. The shape of the sink is adapted to that of the component. Its structure increases the heat dissipation surface area. Some are available in the form of bars that can be cut to size.
The sink's dissipation capacity is a function of its thermal resistance, expressed in degrees Celsius per watt (°C/W). The value should be as low as possible. Calculation of size is based on thermal resistance, ambient temperature, acceptable junction temperature of the component and the power it will dissipate.
The component is screwed or clipped to the sink, or attached using a thermo-conductive adhesive. Generally, the two must be electrically isolated. This is accomplished using a mica insulator and a thermo-conductive silicone or silver paste, or a flexible silicone insulator without paste.
Choice of heat sink will depend on component configuration and thermal resistance, using the appropriate calculations.
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