Ceramic heat sink

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Product description
TO-3P ceramic heat sinks and thermal pads are designed to provide advanced thermal management for high-power applications, specifically insulated-gate bipolar transistor (IGBT) modules. The TO-3P configuration integrates heat dissipation, electrical insulation and mechanical stability to improve reliability of power electronics in demanding operating conditions.

Materials & development
Innovacera manufactures a range of ceramic heat sinks for TO-220, TO-247, TO-3P and TO-264 packages. Primary ceramic materials are alumina (Al₂O₃) and aluminum nitride (AlN). The TO-3P AlN variant serves as an electrically insulating substrate with high thermal conductivity.

Applications

• IGBT module thermal management and power module cooling
• High-temperature power electronics and IGBT junction cooling
• Industrial motor drives and UPS systems
• Solar inverters and wind-turbine converters
• Electric vehicle (EV) traction inverters and onboard chargers
• High-frequency welding equipment and induction heating systems

Performance & benefits

• Reduces hotspot formation and improves thermal uniformity across power modules
• Enhances IGBT switching performance (typical improvement up to 15%)
• Extends module service life (typical extension 2–3× versus conventional solutions)
• Provides electrical insulation while enabling efficient heat dissipation
• Delivers mechanical stability suited to harsh operating environments

Usage notes
Intended for use as ceramic heat sinks or thermal pads where combined thermal conductivity and electrical insulation are required in power electronics assemblies.

Technical specifications

• Model / series: TO-3P (part of TO series: TO-220, TO-247, TO-3P, TO-264)
• Main materials: Alumina (Al₂O₃) and Aluminum Nitride (AlN)
• Functions: Thermal dissipation, electrical insulation, mechanical stability
• Primary applications: IGBT modules, power electronics cooling, inverters, motor drives, EV traction inverters
• Key benefits: Reduced hotspots, improved thermal uniformity, higher switching performance, extended module lifespan