Ceramic plate

aluminaaluminum oxideprotective

Product overview
Alumina ceramic (Al2O3) bases and nozzles are used in semiconductor process equipment such as implanter systems and electron generator components. Available in 95%, 99% and 99.7% Al2O3 grades, these components provide electrical insulation, elevated thermal conductivity and mechanical strength required in high-temperature and high-voltage environments.

Key properties

• Main chemical ingredient: Al2O3 (95% / 99% / 99.7%)
• Bulk density: 3.6 / 3.89 / 3.96 g/cm3
• Maximum use temperature: 1450°C / 1600°C / 1650°C
• Thermal conductivity (20°C): 16 / 30 / 30.4 W/m·K
• Dielectric strength: 8.3 (210) / 8.7 (220) / 8.7 (220) ac-kV/mm (ac V/mil)
• Volume resistivity (100°C): >10^13 / >10^14 / >10^14 ohm·cm
• Flexural strength (20°C): 358 (52) / 550 / 550 MPa
• Compressive strength (20°C): 2068 (300) / 2600 (377) / 2600 (377) MPa
• Fracture toughness K(Ic): 4–5 / 5.6 / 6 MPa·m1/2

Applications
Used as insulation, shielding and wear parts in electron generators, implanter equipment and other semiconductor manufacturing tools. Suitable for components exposed to high temperature, high voltage or corrosive process atmospheres.

Technical specifications

• Main chemical ingredient: Al2O3 (95% / 99% / 99.7%)
• Bulk Density (g/cm3): 3.6 / 3.89 / 3.96
• Maximum Use Temperature: 1450°C / 1600°C / 1650°C
• Water absorption (%): 0 / 0 / 0
• ROHS Hardness: ≥85 / ≥89 / ≥89
• Flexural strength (20°C) MPa (psi x 10^3): 358 (52) / 550 / 550
• Compressive Strength (20°C) MPa (psi x 10^3): 2068 (300) / 2600 (377) / 2600 (377)
• Fracture Toughness K(Ic) MPa·m1/2: 4–5 / 5.6 / 6
• Coefficient of thermal expansion (25-1000°C) 1×10^-6/°C: 7.6 / 7.9 / 8.2
• Thermal conductivity (20°C) W/m·K: 16 / 30 / 30.4
• Thermal Shock Resistance (°C): 250 / 200 / 200
• Dielectricity constant (1MHz, 25°C): 9 / 9.7 / 9.7
• Dielectric strength ac-kV/mm (ac V/mil): 8.3 (210) / 8.7 (220) / 8.7 (220)
• Volume Resistivity (100°C) ohm·cm: >10^13 / >10^14 / >10^14