Aluminum nitride substrates

... processability. Applications: thick/thin-film chip resistors, low-power LEDs, energy storage and charging station substrates.

... Materials & Manufacturing
High thermal conductivity aluminum nitride (AlN) combined with precision thin-film metallization shortens thermal paths and provides a stable platform for die-attach, wire ...

... platforms, heat dissipation and packaging reliability have become core bottlenecks restricting system performance. Aluminum Nitride Ceramic Substrates, with their exceptional thermal conductivity, superior ...

... Overview:
Aluminum nitride (AlN) ceramic substrates provide high thermal conductivity with electrical insulation and a low coefficient of thermal expansion, making them suited to dissipate heat ...

... making them ideal for a variety of wafer-related applications. The Importance of Aluminum Nitride Wafer Substrates Aluminum Nitride Wafer Substrates ...

... Product overview
AMB (Active Metal Brazing) is a high-temperature joining method that creates a chemical bond between ceramic and metal by using active elements (Ti, Zr) in the filler to form a reactive layer ...

... DBC ceramic substrate, short for Direct Bonded Copper Ceramic Substrate, is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a ...

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Materials

• Alumina (Al2O3)
• Zirconia (ZrO2)
• Boron nitride
• Aluminium nitride (AlN)
• Silicon nitride (Si3N4)
• Silicon carbide (SiC)
• Sapphire
• Porous

... Product overview
Our silicon nitride (Si₃N₄) substrates (SN-90) combine high thermal conductivity, elevated mechanical strength and excellent fracture toughness to provide stable performance for high-power electronics ...

... Product overview
High-performance ceramic substrates including alumina (Al2O3), aluminum nitride (AlN), zirconia-toughened alumina (ZTA), silicon nitride (Si3N4) and SiC. Designed ...

... Overview
This Cu-AlN-Cu three-layer submount functions as a heat sink for high-power laser diode (LD) modules. The Cu/AlN/Cu composite structure provides high thermal conductivity while maintaining electrical insulation. Control of Cu plating ...