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... processability. Applications: thick/thin-film chip resistors, low-power LEDs, energy storage and charging station substrates.
Xiamen Innovacera Advanced Materials Co., Ltd
... platforms, heat dissipation and packaging reliability have become core bottlenecks restricting system performance. Aluminum Nitride Ceramic Substrates, with their exceptional thermal conductivity, superior ...
Xiamen Innovacera Advanced Materials Co., Ltd
... Overview:
Aluminum
nitride (AlN) ceramic
substrates provide high thermal conductivity with electrical insulation and a low coefficient of thermal expansion, making them suited to dissipate heat ...
Xiamen Innovacera Advanced Materials Co., Ltd
... making them ideal for a variety of wafer-related applications. The Importance of Aluminum Nitride Wafer Substrates Aluminum Nitride Wafer Substrates ...
Xiamen Innovacera Advanced Materials Co., Ltd
... Product overview
AMB (Active
Metal Brazing) is a high-temperature joining method that creates a chemical bond between ceramic and
metal by using active elements (Ti, Zr) in the filler to form a reactive layer ...
Xiamen Innovacera Advanced Materials Co., Ltd
... DBC ceramic substrate, short for Direct Bonded Copper Ceramic Substrate, is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a ...
Xiamen Innovacera Advanced Materials Co., Ltd
... Multilayer Aluminum Nitride (AlN) substrate and package — up to 15 internal routing layers, 170–180 W/m·K
TDK's AlN multilayer
substrates and packages are designed for wide-band-gap ...
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