Power electronic substrate

ceramicDCBaluminum oxide

DBC ceramic substrate, short for Direct Bonded Copper Ceramic Substrate, is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a hypo-eutectic process. This unique combination of materials results in a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering applications. Direct Bonded Copper Ceramic Substrates Material Property - Low Thermal Expansion - High Strength - High Thermal Conductivity - High Wettability for Solder Direct Bonded Copper Ceramic Substrates Applied Area - Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power Transistors - Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control - Home Appliance: Air Conditioner, Peltier Cooler - Environmental Technology: Local Power Generation, Electric Vehicle, Traction Control System, Photovoltaic Units, Wind Power - Industrial: LED Displays, Welding Machine - Aerospace: Laser, Power Supply for Satellites and Aircrafts - PC/IT: Power Supply, UPS System Key Features / Technical Specifications: - Ceramic substrate: Al2O3 (Alumina) or AlN (Aluminum Nitride) - Copper bonded via hypo-eutectic process - Exceptional thermal conductivity - Low thermal expansion - High mechanical strength - Excellent wettability for soldering